Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 8 Contact(s), 3 mm Pitch, 2 Row, Shrouded

Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits

• High current carrying capacity in a small footprint• High temperature housings for IR reflow soldering• Positive latching for secure mating connection• Fully isolated dual beam terminals for reliable electrical performance and contact• Solder tabs for secure connection to PCB• Glow Wire Compliant

• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• High temperature housings for IR reflow soldering

• Positive latching for secure mating connection

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Solder tabs for secure connection to PCB

• Solder tabs for secure connection to PCB

• Glow Wire Compliant

• Glow Wire Compliant

Product Application Information

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:Military COTS (Commercial Off The Shelf)Solar powerConsumer products (dryers, freezers, fridges, washing machines)Data communications (routers, servers)MedicalTelecommunicationsGaming terminals

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Military COTS (Commercial Off The Shelf)

Solar power

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Data communications (routers, servers)

Medical

Medical

Telecommunications

Telecommunications

Gaming terminals

Gaming terminals

Molex Micro-Fit 3.0 Series