Amphenol Communications Solutions BergStak Series Straight Surface PCB Header, 120 Contact(s), 0.8 mm Pitch, 2 Row,

Housing and terminal profile guarantees support of up to 12Gb/sVertical versus vertical mating configuration40 to 200 position sizes in 20 position increments5 mm to 20 mm stack heights in 1 mm incrementsHousing and terminal profile guarantees support of up to 12Gb/sVertical versus vertical mating configuration40 to 200 position sizes in 20 position increments5 mm to 20 mm stack heights in 1 mm increments0.8 mm double-row contact pitch conserves printed circuit board spaceScoop-proof feature housingsMultiple plating options availableMultiple packaging options availablePCB locator pegs optionLead-freeCompatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heightsSuitable for parallel board stacking applicationsComprehensive range of sizes and stack heights to satisfy all needsHigh density for all electrical applications needsPrevents reverse matingSatisfies different application requirementSuitable for varies feeding processingFacilitates ease and accuracy during manual assembly

Housing and terminal profile guarantees support of up to 12Gb/s

Vertical versus vertical mating configuration

Vertical versus vertical mating configuration

40 to 200 position sizes in 20 position increments

40 to 200 position sizes in 20 position increments

5 mm to 20 mm stack heights in 1 mm increments

5 mm to 20 mm stack heights in 1 mm increments

Housing and terminal profile guarantees support of up to 12Gb/s

Housing and terminal profile guarantees support of up to 12Gb/s

Vertical versus vertical mating configuration

Vertical versus vertical mating configuration

40 to 200 position sizes in 20 position increments

40 to 200 position sizes in 20 position increments

5 mm to 20 mm stack heights in 1 mm increments

5 mm to 20 mm stack heights in 1 mm increments

0.8 mm double-row contact pitch conserves printed circuit board space

0.8 mm double-row contact pitch conserves printed circuit board space

Scoop-proof feature housings

Scoop-proof feature housings

Multiple plating options available

Multiple plating options available

Multiple packaging options available

Multiple packaging options available

PCB locator pegs option

PCB locator pegs option

Lead-free

Lead-free

Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights

Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights

Suitable for parallel board stacking applications

Suitable for parallel board stacking applications

Comprehensive range of sizes and stack heights to satisfy all needs

Comprehensive range of sizes and stack heights to satisfy all needs

High density for all electrical applications needs

High density for all electrical applications needs

Prevents reverse mating

Prevents reverse mating

Satisfies different application requirement

Satisfies different application requirement

Suitable for varies feeding processing

Suitable for varies feeding processing

Facilitates ease and accuracy during manual assembly

Facilitates ease and accuracy during manual assembly

BergStak® 0.80 mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.

BergStak® 0.80 mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.