Amphenol Communications Solutions Bergstik Series Vertical Through Hole Pin Header, 2 Contact(s), 2.54 mm Pitch, 1 Row,

The Amphenol FCI BergStik 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Designed in single and double row. They are available in straight or right angle options, from 2 to 72 positions featuring a “breakaway” design, each connector can be cut or broken to length to suit the application profile. The maximum current rating is 3A per contact. This product range is extended with BergStik 2.54mm unshrouded vertical headers in 0.25μm plating, available in standard sizes. It offers an economical solution for various applications. It is also specified up to 100 mating cycles. BergStik product range provides Board-to-Board, Wire to-Board and Cable-to-Board interconnect solutions for all electronic equipment and devices.

The Amphenol FCI BergStik 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Designed in single and double row. They are available in straight or right angle options, from 2 to 72 positions featuring a “breakaway” design, each connector can be cut or broken to length to suit the application profile. The maximum current rating is 3A per contact. This product range is extended with BergStik 2.54mm unshrouded vertical headers in 0.25μm plating, available in standard sizes. It offers an economical solution for various applications. It is also specified up to 100 mating cycles. BergStik product range provides Board-to-Board, Wire to-Board and Cable-to-Board interconnect solutions for all electronic equipment and devices.

Allow dual entry; mating from top or bottomSuitable for mezzanine application and gives more flexibility in meeting different stack height requirementsCan be used for wire wrappingAllows cleaning to remove soldering contaminationDuplex platingTin-lead plating in press-fit areaEasy pin insertion onto PCBRetention legs optionHigh retention force onto PCB

Allow dual entry; mating from top or bottom

Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements

Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements

Can be used for wire wrapping

Can be used for wire wrapping

Allows cleaning to remove soldering contamination

Allows cleaning to remove soldering contamination

Duplex plating

Duplex plating

Tin-lead plating in press-fit area

Tin-lead plating in press-fit area

Easy pin insertion onto PCB

Easy pin insertion onto PCB

Retention legs option

Retention legs option

High retention force onto PCB

High retention force onto PCB