Transcend MTE370T M.2 (2230) 256 GB Internal SSD

Transcend 256GB M.2 2230 PCIe gen3 x4 SSD - MTE370T

Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3DNAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. TheMTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bondtechnology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting anendurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃.

Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D

NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The

NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The

MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3

MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3

specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond

specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond

technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an

technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an

endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃.

endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃.

Hardware Features

Compliant with RoHS 2.0 standards Compliant with NVM Express specification 1.3 Compliant with PCI Express specification 3.1 Space-saving M.2 form factor (30mm) – ideal for mobile computing devices Single-sided to fit perfectly in small form factor devices

Compliant with RoHS 2.0 standards Compliant with NVM Express specification 1.3 Compliant with PCI Express specification 3.1 Space-saving M.2 form factor (30mm) – ideal for mobile computing devices Single-sided to fit perfectly in small form factor devices

Firmware Features

Supports NVM command SLC caching technology Dynamic thermal throttling Built-in LDPC ECC (Error Correction Code) functionality Advanced Garbage Collection

Supports NVM command SLC caching technology Dynamic thermal throttling Built-in LDPC ECC (Error Correction Code) functionality Advanced Garbage Collection