TE Connectivity AMPMODU Series Vertical Board PCB Header, 20 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

The TE Connectivity PCB Mount Header offers a sophisticated solution for board-to-board applications. Designed with a 20-position configuration and a 1.27 mm centreline, it ensures effective signal transmission while maintaining a compact form factor. The fully shrouded design and gold (Au) plating enhance durability and conductivity, making it suitable for demanding environments. Its vertical orientation facilitates straightforward integration into various PCB layouts, contributing to efficient space management. The housing material is LCP, reflecting advanced thermal and mechanical properties, while the product's robust construction supports a temperature range of -65°C to 105°C. Compliant with industry standards, this connector assembly is an excellent choice for reliable performance in projects across diverse sectors.

The TE Connectivity PCB Mount Header offers a sophisticated solution for board-to-board applications. Designed with a 20-position configuration and a 1.27 mm centreline, it ensures effective signal transmission while maintaining a compact form factor. The fully shrouded design and gold (Au) plating enhance durability and conductivity, making it suitable for demanding environments. Its vertical orientation facilitates straightforward integration into various PCB layouts, contributing to efficient space management. The housing material is LCP, reflecting advanced thermal and mechanical properties, while the product's robust construction supports a temperature range of -65°C to 105°C. Compliant with industry standards, this connector assembly is an excellent choice for reliable performance in projects across diverse sectors.

Optimised for board-to-board connectivity with a fully shrouded header typeCompact design promotes efficient space utilisation in electronic assembliesGold plating ensures superior conductivity and enhanced corrosion resistanceDesigned for high-reliability applications with polarisation for accurate matingHigh-temperature rating supports demanding operational conditionsConforms to strict environmental regulations for sustainable useVersatile termination method allows for quick and reliable surface mount processesLow halogen content aids in compliance with green manufacturing initiatives

Optimised for board-to-board connectivity with a fully shrouded header type

Compact design promotes efficient space utilisation in electronic assemblies

Compact design promotes efficient space utilisation in electronic assemblies

Gold plating ensures superior conductivity and enhanced corrosion resistance

Gold plating ensures superior conductivity and enhanced corrosion resistance

Designed for high-reliability applications with polarisation for accurate mating

Designed for high-reliability applications with polarisation for accurate mating

High-temperature rating supports demanding operational conditions

High-temperature rating supports demanding operational conditions

Conforms to strict environmental regulations for sustainable use

Conforms to strict environmental regulations for sustainable use

Versatile termination method allows for quick and reliable surface mount processes

Versatile termination method allows for quick and reliable surface mount processes

Low halogen content aids in compliance with green manufacturing initiatives

Low halogen content aids in compliance with green manufacturing initiatives