TE Connectivity AMPMODU PCB Headers & Receptacles Series Vertical Board PCB Header, 20 Contact(s), 1.27 mm Pitch, 2 Row,

The TE Connectivity PCB Mount Receptacle is an integral component for board-to-board connections, designed to facilitate efficient signal transmissions. Its unique configuration features 20 positions and a vertical PCB mount orientation, ensuring solid alignment and compact integration into your electronic assemblies. With robust electrical characteristics, including an operating voltage of 30 VAC and excellent insulation resistance, this connector provides reliable performance under diverse operational conditions. Additionally, the device boasts a durable housing material designed to withstand various environmental challenges. This product exemplifies the commitment to quality and functionality expected from industry-leading manufacturers.

The TE Connectivity PCB Mount Receptacle is an integral component for board-to-board connections, designed to facilitate efficient signal transmissions. Its unique configuration features 20 positions and a vertical PCB mount orientation, ensuring solid alignment and compact integration into your electronic assemblies. With robust electrical characteristics, including an operating voltage of 30 VAC and excellent insulation resistance, this connector provides reliable performance under diverse operational conditions. Additionally, the device boasts a durable housing material designed to withstand various environmental challenges. This product exemplifies the commitment to quality and functionality expected from industry-leading manufacturers.

Designed for seamless integration into electronic assembliesOffers a reliable connection for board-to-board applicationsFeatures excellent insulation properties for enhanced safetyProvides a compact design with efficient use of spaceFacilitates easy assembly with its surface mount termination methodConstructed with resilient materials to withstand temperature variationsCompatible with industry standards, ensuring broader application suitabilityOptimised for reflow solder processes, enhancing assembly efficiency

Designed for seamless integration into electronic assemblies

Offers a reliable connection for board-to-board applications

Offers a reliable connection for board-to-board applications

Features excellent insulation properties for enhanced safety

Features excellent insulation properties for enhanced safety

Provides a compact design with efficient use of space

Provides a compact design with efficient use of space

Facilitates easy assembly with its surface mount termination method

Facilitates easy assembly with its surface mount termination method

Constructed with resilient materials to withstand temperature variations

Constructed with resilient materials to withstand temperature variations

Compatible with industry standards, ensuring broader application suitability

Compatible with industry standards, ensuring broader application suitability

Optimised for reflow solder processes, enhancing assembly efficiency

Optimised for reflow solder processes, enhancing assembly efficiency