TE Connectivity AMP HPI Series Vertical Board PCB Header, 8 Contact(s), 1.25 mm Pitch, 1 Row, Shrouded

The TE Connectivity Innovative DIP connector embodies a blend of cutting-edge design and functionality tailored for modern electronic applications. With its reliable wire-to-board connection system, this connector excels in providing seamless connectivity for PCB mount setups. Its sleek profile not only ensures optimal space management on your circuit boards but also guarantees durability with its high-temperature thermoplastic housing. Designed to accommodate a variety of configurations, this connector is ideal for demanding environments, offering trustworthy performance while simplifying assembly. Elevate your electronic projects with this state-of-the-art connector that meets stringent industry standards.

The TE Connectivity Innovative DIP connector embodies a blend of cutting-edge design and functionality tailored for modern electronic applications. With its reliable wire-to-board connection system, this connector excels in providing seamless connectivity for PCB mount setups. Its sleek profile not only ensures optimal space management on your circuit boards but also guarantees durability with its high-temperature thermoplastic housing. Designed to accommodate a variety of configurations, this connector is ideal for demanding environments, offering trustworthy performance while simplifying assembly. Elevate your electronic projects with this state-of-the-art connector that meets stringent industry standards.

A fully shrouded header type enhances reliability through added protectionVertical PCB mount orientation allows for efficient space utilisation in compact designsMatte plating on contact surfaces ensures consistent performance and reduces wearPolarisation features facilitate straightforward and error-free matingHigh-temperature thermoplastic construction promotes resilience in challenging conditionsMaximum current rating of 3A handles robust power demands with easeA compact 1.25 mm pitch facilitates higher density connections without compromiseMulti-termination capabilities support up to three terminations per post

A fully shrouded header type enhances reliability through added protection

Vertical PCB mount orientation allows for efficient space utilisation in compact designs

Vertical PCB mount orientation allows for efficient space utilisation in compact designs

Matte plating on contact surfaces ensures consistent performance and reduces wear

Matte plating on contact surfaces ensures consistent performance and reduces wear

Polarisation features facilitate straightforward and error-free mating

Polarisation features facilitate straightforward and error-free mating

High-temperature thermoplastic construction promotes resilience in challenging conditions

High-temperature thermoplastic construction promotes resilience in challenging conditions

Maximum current rating of 3A handles robust power demands with ease

Maximum current rating of 3A handles robust power demands with ease

A compact 1.25 mm pitch facilitates higher density connections without compromise

A compact 1.25 mm pitch facilitates higher density connections without compromise

Multi-termination capabilities support up to three terminations per post

Multi-termination capabilities support up to three terminations per post