TE Connectivity AMPMODU Series Vertical Board PCB Header, 16 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

The TE Connectivity PCB Mount Receptacle is a meticulously designed connector that caters to numerous board-to-board applications. With its vertical orientation and 16-position capacity, it ensures seamless connectivity across various electronic devices. This high-quality receptacle features a 2.54 mm centreline with gold plating, providing excellent longevity and reliability even in demanding conditions. Constructed from durable polyester with a standard profile, this component stands out in its ability to support both signal transmission and mechanical stability. As part of the AMPMODU IV/V series, it is ideal for engineers aiming to simplify their designs while meeting stringent performance standards.

The TE Connectivity PCB Mount Receptacle is a meticulously designed connector that caters to numerous board-to-board applications. With its vertical orientation and 16-position capacity, it ensures seamless connectivity across various electronic devices. This high-quality receptacle features a 2.54 mm centreline with gold plating, providing excellent longevity and reliability even in demanding conditions. Constructed from durable polyester with a standard profile, this component stands out in its ability to support both signal transmission and mechanical stability. As part of the AMPMODU IV/V series, it is ideal for engineers aiming to simplify their designs while meeting stringent performance standards.

Designed for efficient board-to-board connectivity in limited spacesUtilises gold plating for enhanced durability and electrical conductivitySuitable for applications requiring signal transmissionHigh insulation resistance ensuring safe operationCrafted from robust materials to withstand varying environmental conditionsCompatible with wave solder processes for ease of assemblyStackable configuration allows for flexible design optionsWell-suited for applications within the operating temperature rangeMinimalistic design aids in aligning components accuratelyOffers a reliable solution for board mount configurations

Designed for efficient board-to-board connectivity in limited spaces

Utilises gold plating for enhanced durability and electrical conductivity

Utilises gold plating for enhanced durability and electrical conductivity

Suitable for applications requiring signal transmission

Suitable for applications requiring signal transmission

High insulation resistance ensuring safe operation

High insulation resistance ensuring safe operation

Crafted from robust materials to withstand varying environmental conditions

Crafted from robust materials to withstand varying environmental conditions

Compatible with wave solder processes for ease of assembly

Compatible with wave solder processes for ease of assembly

Stackable configuration allows for flexible design options

Stackable configuration allows for flexible design options

Well-suited for applications within the operating temperature range

Well-suited for applications within the operating temperature range

Minimalistic design aids in aligning components accurately

Minimalistic design aids in aligning components accurately

Offers a reliable solution for board mount configurations

Offers a reliable solution for board mount configurations