TE Connectivity AMP HPI Series Vertical Board PCB Header, 14 Contact(s), 2.5 mm Pitch, 1 Row, Shrouded

The TE Connectivity PCB mount header delivers reliable performance for a range of wire-to-board applications. Designed with a vertical orientation and featuring 14 positions, it is optimised for compact environments. The component's partially shrouded design enhances safety while permitting easy access for soldering. Constructed from durable materials, it ensures long-lasting functionality and optimal electrical connectivity. Operating effectively within a broad temperature range, this connector is equipped to handle demanding circuit applications, reinforcing its versatility in various electronic designs. Its compatibility with standard PCB thicknesses allows for simple integration into existing systems, making it an ideal choice for both new projects and upgrades.

The TE Connectivity PCB mount header delivers reliable performance for a range of wire-to-board applications. Designed with a vertical orientation and featuring 14 positions, it is optimised for compact environments. The component's partially shrouded design enhances safety while permitting easy access for soldering. Constructed from durable materials, it ensures long-lasting functionality and optimal electrical connectivity. Operating effectively within a broad temperature range, this connector is equipped to handle demanding circuit applications, reinforcing its versatility in various electronic designs. Its compatibility with standard PCB thicknesses allows for simple integration into existing systems, making it an ideal choice for both new projects and upgrades.

Utilises a 2.5 mm centreline for modular design flexibilityProvides reliable signal integrity for demanding applicationsConstructed from robust nylon 66 GF for enhanced durabilityIncorporates kinked tines for dependable PCB mount retentionFeatures bright tin plating for improved conductivity and corrosion resistanceSupports wave solder processes for efficient manufacturing

Utilises a 2.5 mm centreline for modular design flexibility

Provides reliable signal integrity for demanding applications

Provides reliable signal integrity for demanding applications

Constructed from robust nylon 66 GF for enhanced durability

Constructed from robust nylon 66 GF for enhanced durability

Incorporates kinked tines for dependable PCB mount retention

Incorporates kinked tines for dependable PCB mount retention

Features bright tin plating for improved conductivity and corrosion resistance

Features bright tin plating for improved conductivity and corrosion resistance

Supports wave solder processes for efficient manufacturing

Supports wave solder processes for efficient manufacturing