TE Connectivity MICTOR Series Board PCB Header, 152 Contact(s), 0.64 mm Pitch, 76 Row, Unshrouded

The TE Connectivity Mount Header is designed to offer excellent performance in straddle mount configurations, facilitating seamless board-to-board connections. With 152 positions and a compact .64 mm centreline pitch, this connector is ideal for high-density applications. Its robust construction features gold plating over palladium nickel, ensuring reliable electrical conductivity and durability. With an impressive data rate of 10 Gb/s, it supports differential signalling, making it suitable for advanced electronic systems. The housing material is liquid crystal polymer, which provides high thermal resistance, while the connector's design also incorporates various mechanical attachment features for ease of use in assembly. This product embodies the perfect balance of functionality and reliability, making it essential for modern electronic assemblies.

The TE Connectivity Mount Header is designed to offer excellent performance in straddle mount configurations, facilitating seamless board-to-board connections. With 152 positions and a compact .64 mm centreline pitch, this connector is ideal for high-density applications. Its robust construction features gold plating over palladium nickel, ensuring reliable electrical conductivity and durability. With an impressive data rate of 10 Gb/s, it supports differential signalling, making it suitable for advanced electronic systems. The housing material is liquid crystal polymer, which provides high thermal resistance, while the connector's design also incorporates various mechanical attachment features for ease of use in assembly. This product embodies the perfect balance of functionality and reliability, making it essential for modern electronic assemblies.

Designed for high-density applications and offers efficient space utilisationGold plating over palladium nickel enhances connection reliabilitySupports differential signalling for superior data transmissionDurable construction ensures longevity in demanding environmentsIntegrates easily into various PCB layouts with a straddle mount orientationFacilitates straightforward assembly with mechanical attachment featuresOperates effectively within a broad temperature range for versatile usageUL listed for safety compliance and industry standards approval

Designed for high-density applications and offers efficient space utilisation

Gold plating over palladium nickel enhances connection reliability

Gold plating over palladium nickel enhances connection reliability

Supports differential signalling for superior data transmission

Supports differential signalling for superior data transmission

Durable construction ensures longevity in demanding environments

Durable construction ensures longevity in demanding environments

Integrates easily into various PCB layouts with a straddle mount orientation

Integrates easily into various PCB layouts with a straddle mount orientation

Facilitates straightforward assembly with mechanical attachment features

Facilitates straightforward assembly with mechanical attachment features

Operates effectively within a broad temperature range for versatile usage

Operates effectively within a broad temperature range for versatile usage

UL listed for safety compliance and industry standards approval

UL listed for safety compliance and industry standards approval