TE Connectivity MICTOR Series Vertical Board PCB Header, 80 Contact(s), 0.8 mm Pitch

The TE Connectivity PCB Mount Header is designed for vertical configurations, facilitating efficient board-to-board connections. Engineered with 80 positions, this connector ensures a compact assembly while maintaining optimal signal integrity. The 0.8 mm centreline pitch allows for high-density applications where space is at a premium. It boasts a robust construction featuring gold plating for enhanced durability and conductivity, perfect for power and signal applications. Its compatibility with various circuit applications makes it an essential component in modern electronic systems. This product’s low halogen content contributes to environmentally-friendly practices, aligning with contemporary regulations. Whether for prototyping or mass production, this header stands out for its reliability and performance in demanding environments.

The TE Connectivity PCB Mount Header is designed for vertical configurations, facilitating efficient board-to-board connections. Engineered with 80 positions, this connector ensures a compact assembly while maintaining optimal signal integrity. The 0.8 mm centreline pitch allows for high-density applications where space is at a premium. It boasts a robust construction featuring gold plating for enhanced durability and conductivity, perfect for power and signal applications. Its compatibility with various circuit applications makes it an essential component in modern electronic systems. This product’s low halogen content contributes to environmentally-friendly practices, aligning with contemporary regulations. Whether for prototyping or mass production, this header stands out for its reliability and performance in demanding environments.

High-density design accommodates 80 positionsOptimally configured for board-to-board connectivityDurable gold plating enhances electrical performanceLow halogen content supports environmental complianceCompatible with various circuit applicationsVertical orientation assists in space-constrained installationsSupport for reflow soldering capabilities simplifies assembly

High-density design accommodates 80 positions

Optimally configured for board-to-board connectivity

Optimally configured for board-to-board connectivity

Durable gold plating enhances electrical performance

Durable gold plating enhances electrical performance

Low halogen content supports environmental compliance

Low halogen content supports environmental compliance

Compatible with various circuit applications

Compatible with various circuit applications

Vertical orientation assists in space-constrained installations

Vertical orientation assists in space-constrained installations

Support for reflow soldering capabilities simplifies assembly

Support for reflow soldering capabilities simplifies assembly