TE Connectivity 5-104 Series Vertical Surface PCB Header, 70 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

The TE Connectivity PCB Mount Header is an innovative solution designed for seamless board-to-board connections. With its sleek vertical orientation and precision-engineered components, this connector ensures reliable performance across a multitude of applications. The 70-position configuration provides ample connectivity options, while the 1.27 mm (.05 in) centreline spacing allows for efficient space utilisation on printed circuit boards. Fully shrouded to enhance stability, this header features gold-plated contacts for superior conductivity and corrosion resistance. Its surface mount orientation and robust thermoplastic housing material guarantee durability, making it an ideal choice for demanding environments. The compatibility with industry standards further strengthens its positioning as a top-notch component for electronic interconnections.

The TE Connectivity PCB Mount Header is an innovative solution designed for seamless board-to-board connections. With its sleek vertical orientation and precision-engineered components, this connector ensures reliable performance across a multitude of applications. The 70-position configuration provides ample connectivity options, while the 1.27 mm (.05 in) centreline spacing allows for efficient space utilisation on printed circuit boards. Fully shrouded to enhance stability, this header features gold-plated contacts for superior conductivity and corrosion resistance. Its surface mount orientation and robust thermoplastic housing material guarantee durability, making it an ideal choice for demanding environments. The compatibility with industry standards further strengthens its positioning as a top-notch component for electronic interconnections.

Designed for reliable board-to-board connectivity in compact spacesFully shrouded header type enhances mechanical stabilityUtilises gold plating for improved electrical performanceConstructed from high-quality thermoplastic for durabilityParallel configuration facilitates optimal electrical performanceMating alignment is streamlined through keyed designLow-halogen composition supports environmental standardsCompatible with reflow soldering processes, ensuring ease of assembly

Designed for reliable board-to-board connectivity in compact spaces

Fully shrouded header type enhances mechanical stability

Fully shrouded header type enhances mechanical stability

Utilises gold plating for improved electrical performance

Utilises gold plating for improved electrical performance

Constructed from high-quality thermoplastic for durability

Constructed from high-quality thermoplastic for durability

Parallel configuration facilitates optimal electrical performance

Parallel configuration facilitates optimal electrical performance

Mating alignment is streamlined through keyed design

Mating alignment is streamlined through keyed design

Low-halogen composition supports environmental standards

Low-halogen composition supports environmental standards

Compatible with reflow soldering processes, ensuring ease of assembly

Compatible with reflow soldering processes, ensuring ease of assembly