TE Connectivity, 19822 3mm Pitch Connector Backplane Connector, Receptacle, Vertical, 5 Column, 5 Way, 1982257-5

The TE Connectivity Z-PACK Slim UHD, Hard Metric Backplane Connector is meticulously engineered for high-performance PCB applications. Designed to facilitate seamless board-to-board connectivity, this connector ensures reliable signal integrity and mechanical stability. Its traditional backplane architecture allows for efficient mass interconnection, making it ideal for complex electronic systems. With a PCB mount receptacle assembly type, it provides an optimal fit for vertical mounting orientations, allowing for streamlined integration into your design. The compact configuration features five columns and five positions, ensuring effective use of space without compromising functionality. Built to withstand extreme operating temperatures, this connector demonstrates exceptional durability and compliance with stringent industry standards.

The TE Connectivity Z-PACK Slim UHD, Hard Metric Backplane Connector is meticulously engineered for high-performance PCB applications. Designed to facilitate seamless board-to-board connectivity, this connector ensures reliable signal integrity and mechanical stability. Its traditional backplane architecture allows for efficient mass interconnection, making it ideal for complex electronic systems. With a PCB mount receptacle assembly type, it provides an optimal fit for vertical mounting orientations, allowing for streamlined integration into your design. The compact configuration features five columns and five positions, ensuring effective use of space without compromising functionality. Built to withstand extreme operating temperatures, this connector demonstrates exceptional durability and compliance with stringent industry standards.

Facilitates efficient board-to-board connectivity for enhanced signal integritySupports high-density layouts with its compact five-column designUtilises a traditional backplane architecture tailored for mass interconnectionsComplies with various industry standards, ensuring reliability and performanceConstructed with gold-plated contacts for superior mating area longevityResistant to extreme temperature ranges, ensuring consistent performance in challenging conditionsLow halogen materials promote environmental responsibility and complianceCompatible with a range of TE’s Z-PACK Slim UHD connector series for versatile applications

Facilitates efficient board-to-board connectivity for enhanced signal integritySupports high-density layouts with its compact five-column designUtilises a traditional backplane architecture tailored for mass interconnectionsComplies with various industry standards, ensuring reliability and performanceConstructed with gold-plated contacts for superior mating area longevityResistant to extreme temperature ranges, ensuring consistent performance in challenging conditionsLow halogen materials promote environmental responsibility and complianceCompatible with a range of TE’s Z-PACK Slim UHD connector series for versatile applications