TE Connectivity LUMAWISE Series Wire to Board, 3-Pole, 3-Way, Board Mount, 8.5A

The TE Connectivity Wire-to-board connector is engineered for precision and reliability in various electronic applications. Designed with a 3-position configuration and a compact .16 mm centreline pitch, it optimally connects printed circuit boards with insulation displacement technology. Its closed-end design ensures secure and efficient electrical connections, making it an ideal choice for applications requiring dependable performance in demanding environments. This connector accommodates a wide range of wire sizes and operates effectively within an extensive temperature range, proving its versatility across numerous industries.

The TE Connectivity Wire-to-board connector is engineered for precision and reliability in various electronic applications. Designed with a 3-position configuration and a compact .16 mm centreline pitch, it optimally connects printed circuit boards with insulation displacement technology. Its closed-end design ensures secure and efficient electrical connections, making it an ideal choice for applications requiring dependable performance in demanding environments. This connector accommodates a wide range of wire sizes and operates effectively within an extensive temperature range, proving its versatility across numerous industries.

Accommodates wire sizes from 18 to 16 AWG for flexible integrationOffers a maximum current rating of 8.5 A, suitable for power applicationsUtilises through-hole solder termination for robust and enduring connectivityFeatures low halogen content, aligning with environmental standardsDesigned for board mount applications, enhancing space efficiencyCompliant with EU RoHS and REACH regulations ensuring environmental safetySolder process capability up to 245°C allows for compatibility with modern assembly techniques

Accommodates wire sizes from 18 to 16 AWG for flexible integrationOffers a maximum current rating of 8.5 A, suitable for power applicationsUtilises through-hole solder termination for robust and enduring connectivityFeatures low halogen content, aligning with environmental standardsDesigned for board mount applications, enhancing space efficiencyCompliant with EU RoHS and REACH regulations ensuring environmental safetySolder process capability up to 245°C allows for compatibility with modern assembly techniques