TE Connectivity 23276 Series Vertical Receptacle Edge Connector, Board Mount, 56-Contacts, 0.6mm Pitch, 2-Row, Surface

The TE Connectivity Advanced internal I/O connector is designed specifically for high-performance applications requiring reliable signal integrity and optimal performance. The connector leverages cutting-edge technology to seamlessly connect printed circuit boards with vertical cable-to-board orientation, ensuring compact integration. Featuring a robust surface mount design, it supports a substantial number of 56 positions, making it ideal for sophisticated electronic devices that demand precision. Its construction incorporates high-quality materials, ensuring durability and longevity in various operational environments. With an operating temperature range from -55°C to 85°C, this connector is perfect for diverse applications across multiple industries including data storage and telecommunications. Embracing compliance with EU RoHS directives, it reflects a commitment to sustainable manufacturing practices without sacrificing performance.

The TE Connectivity Advanced internal I/O connector is designed specifically for high-performance applications requiring reliable signal integrity and optimal performance. The connector leverages cutting-edge technology to seamlessly connect printed circuit boards with vertical cable-to-board orientation, ensuring compact integration. Featuring a robust surface mount design, it supports a substantial number of 56 positions, making it ideal for sophisticated electronic devices that demand precision. Its construction incorporates high-quality materials, ensuring durability and longevity in various operational environments. With an operating temperature range from -55°C to 85°C, this connector is perfect for diverse applications across multiple industries including data storage and telecommunications. Embracing compliance with EU RoHS directives, it reflects a commitment to sustainable manufacturing practices without sacrificing performance.

Optimised for vertical PCB edge card applicationsHigh reliability with a signal circuit application designFeatures a low profile to enhance space efficiency within enclosuresConstructed to withstand rigorous stress and environmental conditionsSupports significant current ratings for demanding applicationsUtilises tin and gold plating for enhanced contact performancePerfectly suited for integration into EDSFF and Gen Z compliant systems

Optimised for vertical PCB edge card applicationsHigh reliability with a signal circuit application designFeatures a low profile to enhance space efficiency within enclosuresConstructed to withstand rigorous stress and environmental conditionsSupports significant current ratings for demanding applicationsUtilises tin and gold plating for enhanced contact performancePerfectly suited for integration into EDSFF and Gen Z compliant systems