TE Connectivity AMPMODU Series Vertical Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

The TE Connectivity PCB Mount Header is a versatile interconnect solution designed for seamless wire-to-board connections in various electronic applications. Featuring a fully shrouded design, this connector boasts a compact 12-position configuration with a 2.54 mm centreline, making it ideal for space-constrained environments. Engineered for reliability, the header ensures a secure electrical connection through its through-hole solder termination method. The robust construction facilitates ease of installation, while the high-quality materials selected enhance the performance across a wide operating temperature range. This product is an essential choice for engineers seeking dependable connectivity solutions in demanding conditions.

The TE Connectivity PCB Mount Header is a versatile interconnect solution designed for seamless wire-to-board connections in various electronic applications. Featuring a fully shrouded design, this connector boasts a compact 12-position configuration with a 2.54 mm centreline, making it ideal for space-constrained environments. Engineered for reliability, the header ensures a secure electrical connection through its through-hole solder termination method. The robust construction facilitates ease of installation, while the high-quality materials selected enhance the performance across a wide operating temperature range. This product is an essential choice for engineers seeking dependable connectivity solutions in demanding conditions.

Compact design optimised for space efficiencyFully shrouded to provide protection against environmental factorsReliable wire to board connection for improved signal integritySolder termination method enables strong lasting connectionsThermoplastic housing ensures longevity and durabilityMating retention mechanism enhances connection stability

Compact design optimised for space efficiency

Fully shrouded to provide protection against environmental factors

Fully shrouded to provide protection against environmental factors

Reliable wire to board connection for improved signal integrity

Reliable wire to board connection for improved signal integrity

Solder termination method enables strong lasting connections

Solder termination method enables strong lasting connections

Thermoplastic housing ensures longevity and durability

Thermoplastic housing ensures longevity and durability

Mating retention mechanism enhances connection stability

Mating retention mechanism enhances connection stability