TE Connectivity AMPMODU 50/50 Grid Series Vertical Surface PCB Header, 40 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

The TE Connectivity PCB Mount Header seamlessly integrates into your electronic projects, providing robust connectivity solutions. Featuring a vertical configuration and a fully shrouded design, it accommodates up to 40 positions while ensuring reliability and ease of use. The 1.27 mm centreline spacing enhances compatibility with various PCB designs, catering to both hobbyists and professionals alike. Crafted with high-quality materials, the connector boasts gold plating for optimal conductivity, ensuring that your applications can perform under demanding conditions. With a rated operating voltage of 30 VAC, it is suitable for a multitude of applications, promising durability and longevity. The surface mount design further simplifies installation, making it an essential component for modern electronics.

The TE Connectivity PCB Mount Header seamlessly integrates into your electronic projects, providing robust connectivity solutions. Featuring a vertical configuration and a fully shrouded design, it accommodates up to 40 positions while ensuring reliability and ease of use. The 1.27 mm centreline spacing enhances compatibility with various PCB designs, catering to both hobbyists and professionals alike. Crafted with high-quality materials, the connector boasts gold plating for optimal conductivity, ensuring that your applications can perform under demanding conditions. With a rated operating voltage of 30 VAC, it is suitable for a multitude of applications, promising durability and longevity. The surface mount design further simplifies installation, making it an essential component for modern electronics.

Vertical orientation optimises space on circuit boardsFully shrouded feature enhances protection against dust and foreign matterDesigned for board to board connections enhancing versatilityConstructed with copper alloy for improved retention and durabilityMating alignment is keyed for precise connectionsStandard profile ensures compatibility with existing design layouts

Vertical orientation optimises space on circuit boards

Fully shrouded feature enhances protection against dust and foreign matter

Fully shrouded feature enhances protection against dust and foreign matter

Designed for board to board connections enhancing versatility

Designed for board to board connections enhancing versatility

Constructed with copper alloy for improved retention and durability

Constructed with copper alloy for improved retention and durability

Mating alignment is keyed for precise connections

Mating alignment is keyed for precise connections

Standard profile ensures compatibility with existing design layouts

Standard profile ensures compatibility with existing design layouts