TE Connectivity Z-PACK HS3 Series Vertical Board PCB Header, 50 Contact(s), 2.5 mm Pitch, 10 Row, Shrouded

The TE Connectivity 50 Position High Speed Backplane Connector is a meticulously engineered solution designed for exceptional performance in demanding electronic applications. This connector features a vertical PCB mount header configuration, offering unparalleled space efficiency while maintaining robust connectivity. It is part of the Z-PACK HS3 series, known for its reliability and high-speed characteristics. With 10 rows and 5 columns of meticulously arranged contact pins, this connector ensures optimal signal integrity and maintains a compact footprint. It is designed to excel in a diverse range of environments, operating efficiently in temperatures ranging from -65 to 105 °C. The partially shrouded design not only enhances mating reliability but also simplifies installation, making it an ideal choice for modern high-speed backplane systems. This connector meets stringent industry standards for quality and safety, ensuring peace of mind in critical applications.

The TE Connectivity 50 Position High Speed Backplane Connector is a meticulously engineered solution designed for exceptional performance in demanding electronic applications. This connector features a vertical PCB mount header configuration, offering unparalleled space efficiency while maintaining robust connectivity. It is part of the Z-PACK HS3 series, known for its reliability and high-speed characteristics. With 10 rows and 5 columns of meticulously arranged contact pins, this connector ensures optimal signal integrity and maintains a compact footprint. It is designed to excel in a diverse range of environments, operating efficiently in temperatures ranging from -65 to 105 °C. The partially shrouded design not only enhances mating reliability but also simplifies installation, making it an ideal choice for modern high-speed backplane systems. This connector meets stringent industry standards for quality and safety, ensuring peace of mind in critical applications.

Designed for high-speed applications, ensuring minimal signal degradationVertical orientation provides efficient use of space in compact assembliesPolarisation feature simplifies mating and enhances engagement reliabilityConstructed with a rugged polyester housing for long-lasting performanceNickel contact underplating ensures excellent conductivity and durabilityCompatible with industry-standard PCB thickness for effortless integrationLow-halogen materials support environmental compliance for sustainable manufacturingRounded contact design optimises mating and reduces wear over time

Designed for high-speed applications, ensuring minimal signal degradation

Vertical orientation provides efficient use of space in compact assemblies

Vertical orientation provides efficient use of space in compact assemblies

Polarisation feature simplifies mating and enhances engagement reliability

Polarisation feature simplifies mating and enhances engagement reliability

Constructed with a rugged polyester housing for long-lasting performance

Constructed with a rugged polyester housing for long-lasting performance

Nickel contact underplating ensures excellent conductivity and durability

Nickel contact underplating ensures excellent conductivity and durability

Compatible with industry-standard PCB thickness for effortless integration

Compatible with industry-standard PCB thickness for effortless integration

Low-halogen materials support environmental compliance for sustainable manufacturing

Low-halogen materials support environmental compliance for sustainable manufacturing

Rounded contact design optimises mating and reduces wear over time

Rounded contact design optimises mating and reduces wear over time