TE Connectivity AMP-HDI Series Vertical Board PCB Header, 120 Contact(s), 2.54 mm Pitch, 4 Row, Shrouded

The TE Connectivity PCB Mount Header is designed for robust and efficient board-to-board connections, featuring a sleek vertical orientation that optimises spatial constraints on the PCB. Manufactured with a fully shrouded design, it ensures secure and reliable signal transmission, making it ideal for high-density applications. This connector boasts 120 positions arranged in a systematic layout, facilitating easy integration within various electronic assemblies. The combination of gold-plated contacts and durable thermoplastic housing signifies its suitability for demanding operating conditions, while its 2.54 mm centreline provides compatibility with standard PCB layouts, enabling seamless integration into diverse electronic systems.

The TE Connectivity PCB Mount Header is designed for robust and efficient board-to-board connections, featuring a sleek vertical orientation that optimises spatial constraints on the PCB. Manufactured with a fully shrouded design, it ensures secure and reliable signal transmission, making it ideal for high-density applications. This connector boasts 120 positions arranged in a systematic layout, facilitating easy integration within various electronic assemblies. The combination of gold-plated contacts and durable thermoplastic housing signifies its suitability for demanding operating conditions, while its 2.54 mm centreline provides compatibility with standard PCB layouts, enabling seamless integration into diverse electronic systems.

Encapsulates advanced four-beam contact shape for enhanced conductivityBlack thermoplastic construction offers resilience against environmental stressorsDesigned with retention solder tails for secure mountingKeyed alignment simplifies mating and installation processesCapable of withstanding high insulation resistance, crucial for signal integrityPresenting low halogen content, it supports environmentally conscious solutionsPackaged in tubes to facilitate straightforward storage and handlingNon-stackable design ensures precise connection without displacement

Encapsulates advanced four-beam contact shape for enhanced conductivity

Black thermoplastic construction offers resilience against environmental stressors

Black thermoplastic construction offers resilience against environmental stressors

Designed with retention solder tails for secure mounting

Designed with retention solder tails for secure mounting

Keyed alignment simplifies mating and installation processes

Keyed alignment simplifies mating and installation processes

Capable of withstanding high insulation resistance, crucial for signal integrity

Capable of withstanding high insulation resistance, crucial for signal integrity

Presenting low halogen content, it supports environmentally conscious solutions

Presenting low halogen content, it supports environmentally conscious solutions

Packaged in tubes to facilitate straightforward storage and handling

Packaged in tubes to facilitate straightforward storage and handling

Non-stackable design ensures precise connection without displacement

Non-stackable design ensures precise connection without displacement