TE Connectivity AMP-LATCH Series Vertical Cable PCB Connector, 24 Contact(s), 2.54 mm Pitch, 2 Row

The TE Connectivity wire-to-board connector is expertly designed for applications requiring reliable and efficient power and signal transmission. Featuring 24 positions and a compact 2.54 mm centreline pitch, it provides exceptional versatility for various circuit configurations. The vertical, through-hole solder receptacle offers a secure connection, ideal for both industrial and consumer electronics. Enhanced with AMP-LATCH technology, this connector ensures dependable mating, preventing accidental disconnection during operation. Built for durability, it operates effectively across a wide temperature range, making it suitable for demanding environments. Its low profile and thermoplastic housing material ensure an efficient footprint, meeting the contemporary requirements of modern circuitry while maintaining robust performance standards.

The TE Connectivity wire-to-board connector is expertly designed for applications requiring reliable and efficient power and signal transmission. Featuring 24 positions and a compact 2.54 mm centreline pitch, it provides exceptional versatility for various circuit configurations. The vertical, through-hole solder receptacle offers a secure connection, ideal for both industrial and consumer electronics. Enhanced with AMP-LATCH technology, this connector ensures dependable mating, preventing accidental disconnection during operation. Built for durability, it operates effectively across a wide temperature range, making it suitable for demanding environments. Its low profile and thermoplastic housing material ensure an efficient footprint, meeting the contemporary requirements of modern circuitry while maintaining robust performance standards.

Optimised for wire-to-board applications, providing excellent connectivityDesigned for easy assembly with an efficient through-hole solder techniqueLow connector profile effectively minimises space in tight enclosuresRobust construction ensures long-lasting performance in harsh conditionsOperating temperature range promotes versatility in diverse applicationsNickel underplating provides enhanced contact reliabilityMating alignment features facilitate seamless and precise connector engagementCompatible with various wire sizes, accommodating different design needs

Optimised for wire-to-board applications, providing excellent connectivity

Designed for easy assembly with an efficient through-hole solder technique

Designed for easy assembly with an efficient through-hole solder technique

Low connector profile effectively minimises space in tight enclosures

Low connector profile effectively minimises space in tight enclosures

Robust construction ensures long-lasting performance in harsh conditions

Robust construction ensures long-lasting performance in harsh conditions

Operating temperature range promotes versatility in diverse applications

Operating temperature range promotes versatility in diverse applications

Nickel underplating provides enhanced contact reliability

Nickel underplating provides enhanced contact reliability

Mating alignment features facilitate seamless and precise connector engagement

Mating alignment features facilitate seamless and precise connector engagement

Compatible with various wire sizes, accommodating different design needs

Compatible with various wire sizes, accommodating different design needs