TE Connectivity MICTOR Series Vertical Board PCB Header, 114 Contact(s), 0.64 mm Pitch, 57 Row, Unshrouded

The TE Connectivity PCB Mount Header is designed to excel in various demanding applications, serving as an essential component in board-to-board connections. With its impressive design and robust electrical characteristics, this connector ensures high performance in transmitting signals. Ideal for use in compact electronic devices where space is at a premium, this connector is engineered using LCP (Liquid Crystal Polymer) material, offering durability and reliability. Its vertical orientation allows for efficient space utilisation on the PCB, while the dual beam contact shape enhances signal integrity. This connector is tailored for high-speed applications, providing consistent data transfer speeds up to 10 Gb/s, making it an optimal choice for modern electronic systems.

The TE Connectivity PCB Mount Header is designed to excel in various demanding applications, serving as an essential component in board-to-board connections. With its impressive design and robust electrical characteristics, this connector ensures high performance in transmitting signals. Ideal for use in compact electronic devices where space is at a premium, this connector is engineered using LCP (Liquid Crystal Polymer) material, offering durability and reliability. Its vertical orientation allows for efficient space utilisation on the PCB, while the dual beam contact shape enhances signal integrity. This connector is tailored for high-speed applications, providing consistent data transfer speeds up to 10 Gb/s, making it an optimal choice for modern electronic systems.

Offers excellent insulation resistance, ensuring longevity and reliabilityDesigned with a stack height of 6.6 mm, accommodating various layoutsFeatures a mating alignment system for accurate connectionsProvides high current ratings up to 11.5 A, suitable for power applicationsCompact design allows for versatile use in limited-space settingsManufactured for reflow soldering at temperatures up to 260°C, ensuring compatibility with modern assembly processesLow halogen content enhances environmental responsibilityThe connector system supports both signal and power connections efficiently

Offers excellent insulation resistance, ensuring longevity and reliability

Designed with a stack height of 6.6 mm, accommodating various layouts

Designed with a stack height of 6.6 mm, accommodating various layouts

Features a mating alignment system for accurate connections

Features a mating alignment system for accurate connections

Provides high current ratings up to 11.5 A, suitable for power applications

Provides high current ratings up to 11.5 A, suitable for power applications

Compact design allows for versatile use in limited-space settings

Compact design allows for versatile use in limited-space settings

Manufactured for reflow soldering at temperatures up to 260°C, ensuring compatibility with modern assembly processes

Manufactured for reflow soldering at temperatures up to 260°C, ensuring compatibility with modern assembly processes

Low halogen content enhances environmental responsibility

Low halogen content enhances environmental responsibility

The connector system supports both signal and power connections efficiently

The connector system supports both signal and power connections efficiently