TE Connectivity, Z-Pack 1.9mm Pitch High Speed High Speed Backplane Connector, Male, Vertical, 8 Column, 15 Row, 120 Way

The TE Connectivity 120 Position High Speed Backplane Connector is expertly engineered to facilitate seamless data transmission in high-performance applications. Designed with 15 rows and 8 columns, this PCB mount header is fully shrouded and features a 1.9 mm centreline, providing reliable connectivity in compact spaces. Its robust construction and impressive specifications ensure optimal signal integrity, making it an ideal choice for traditional backplane architectures. With an operating voltage of 250 VAC and an impedance of 100 Ω, this connector is built to handle demanding electrical environments while maintaining peak performance. Whether used in telecommunications, computing, or industrial systems, this component ensures durability and reliability across various applications, setting a benchmark in connector technology.

The TE Connectivity 120 Position High Speed Backplane Connector is expertly engineered to facilitate seamless data transmission in high-performance applications. Designed with 15 rows and 8 columns, this PCB mount header is fully shrouded and features a 1.9 mm centreline, providing reliable connectivity in compact spaces. Its robust construction and impressive specifications ensure optimal signal integrity, making it an ideal choice for traditional backplane architectures. With an operating voltage of 250 VAC and an impedance of 100 Ω, this connector is built to handle demanding electrical environments while maintaining peak performance. Whether used in telecommunications, computing, or industrial systems, this component ensures durability and reliability across various applications, setting a benchmark in connector technology.

Robust construction for maximum durability in various environmentsOptimised for high-speed data applications, supporting data rates of up to 10 Gb/sDifferential impedance maintains signal integrity for reliable performanceVertical PCB mount orientation allows for effective space managementAdvanced mating alignment features ensure secure connections during operationLow halogen content supports environmentally responsible practicesMatte finish plating enhances resistance to wear and tearEasy integration into traditional backplane architectures for versatile applicationsConfigured with compliant tail technology for improved retention during assembly

Robust construction for maximum durability in various environmentsOptimised for high-speed data applications, supporting data rates of up to 10 Gb/sDifferential impedance maintains signal integrity for reliable performanceVertical PCB mount orientation allows for effective space managementAdvanced mating alignment features ensure secure connections during operationLow halogen content supports environmentally responsible practicesMatte finish plating enhances resistance to wear and tearEasy integration into traditional backplane architectures for versatile applicationsConfigured with compliant tail technology for improved retention during assembly