TE Connectivity, Z-Pack 1.9mm Pitch High Speed High Speed Backplane Connector, Male, Vertical, 10 Column, 12 Row, 120

The TE Connectivity high-speed backplane connector is specifically designed for demanding electronic applications, ensuring a robust and reliable connection. The product features a carefully engineered design, incorporating 120 positions across 12 rows and 10 columns, perfectly tailored for PCB mounting. The vertical orientation and fully shrouded structure not only offer superior electrical performance but also enhance mechanical strength. With a centreline of 1.9 mm, the connector accommodates high-density layouts, making it ideal for cutting-edge technology environments where space is at a premium. This backplane connector is perfect for signalling applications, achieving impressive data rates of up to 10 Gb/s. Built with the highest compliance standards, it guarantees reliability and efficiency in various conditions.

The TE Connectivity high-speed backplane connector is specifically designed for demanding electronic applications, ensuring a robust and reliable connection. The product features a carefully engineered design, incorporating 120 positions across 12 rows and 10 columns, perfectly tailored for PCB mounting. The vertical orientation and fully shrouded structure not only offer superior electrical performance but also enhance mechanical strength. With a centreline of 1.9 mm, the connector accommodates high-density layouts, making it ideal for cutting-edge technology environments where space is at a premium. This backplane connector is perfect for signalling applications, achieving impressive data rates of up to 10 Gb/s. Built with the highest compliance standards, it guarantees reliability and efficiency in various conditions.

Designed for high-density applications, minimising PCB footprintOperates effectively within a broad temperature range, ensuring versatilitySupports differential signalling for enhanced data integrityIncorporates a traditional backplane architecture for reliable performanceFeatures a fully shrouded design to protect against environmental factorsEquipped with compliant tail technology for secure PCB attachmentUtilises low halogen materials, promoting eco-friendliness

Designed for high-density applications, minimising PCB footprintOperates effectively within a broad temperature range, ensuring versatilitySupports differential signalling for enhanced data integrityIncorporates a traditional backplane architecture for reliable performanceFeatures a fully shrouded design to protect against environmental factorsEquipped with compliant tail technology for secure PCB attachmentUtilises low halogen materials, promoting eco-friendliness