TE Connectivity Spacer for use with Hard Metric Connectors

The TE Connectivity Innovative spacer is designed for optimal performance within the Z-PACK series, providing seamless integration in your electronic assemblies. The robust construction ensures durability, making it ideal for applications where reliability is paramount. Its compact design allows for efficient use of space, catering to modern design specifications. With compliance to various directives such as EU RoHS and REACH, this product aligns with environmental standards, making it a responsible choice for today’s conscientious manufacturers. This spacer is not only functional but also enhances the overall assembly with its technically advanced features, ensuring that your projects are both efficient and effective in achieving desired outcomes.

The TE Connectivity Innovative spacer is designed for optimal performance within the Z-PACK series, providing seamless integration in your electronic assemblies. The robust construction ensures durability, making it ideal for applications where reliability is paramount. Its compact design allows for efficient use of space, catering to modern design specifications. With compliance to various directives such as EU RoHS and REACH, this product aligns with environmental standards, making it a responsible choice for today’s conscientious manufacturers. This spacer is not only functional but also enhances the overall assembly with its technically advanced features, ensuring that your projects are both efficient and effective in achieving desired outcomes.

Ensures compatibility with a variety of board-to-board headersFacilitates stable connections in high-density applicationsConstructed from high-quality materials for enhanced longevityComplies with stringent international environmental regulationsDesigned to support efficient thermal management in assembliesOffers flexibility for custom configurations in electronic designs

Ensures compatibility with a variety of board-to-board headersFacilitates stable connections in high-density applicationsConstructed from high-quality materials for enhanced longevityComplies with stringent international environmental regulationsDesigned to support efficient thermal management in assembliesOffers flexibility for custom configurations in electronic designs