TE Connectivity 5179031 Series Vertical Board PCB Header, 160 Contact(s), 0.8 mm Pitch, Shrouded

The TE Connectivity PCB Mount Header is designed for vertical, board-to-board applications, featuring a precise 160 position configuration with an 0.8 mm centreline. This fully shrouded connector is engineered for ease of use and exceptional reliability, making it suitable for various electronic assemblies. With a robust construction and high-quality materials, it ensures durability and optimal performance in diverse operating conditions. Offering surface mounting capabilities, this connector also maintains a free height, which allows for greater flexibility in circuit design. Designed with a focus on reliability and efficiency, it meets stringent electrical and mechanical standards, ensuring compatibility across a wide array of applications while facilitating seamless integration into existing systems.

The TE Connectivity PCB Mount Header is designed for vertical, board-to-board applications, featuring a precise 160 position configuration with an 0.8 mm centreline. This fully shrouded connector is engineered for ease of use and exceptional reliability, making it suitable for various electronic assemblies. With a robust construction and high-quality materials, it ensures durability and optimal performance in diverse operating conditions. Offering surface mounting capabilities, this connector also maintains a free height, which allows for greater flexibility in circuit design. Designed with a focus on reliability and efficiency, it meets stringent electrical and mechanical standards, ensuring compatibility across a wide array of applications while facilitating seamless integration into existing systems.

PCB mount orientation enhances design flexibilityParallel board-to-board configuration optimises space utilisationStackable design allows for multiple levels of connectionsHigh surface mount capability supports advanced assembly techniquesNatural housing colour complements various PCB aestheticsPolarisation feature improves mating accuracyLow halogen materials support environmental complianceReflow solder capability simplifies manufacturing processes

PCB mount orientation enhances design flexibility

Parallel board-to-board configuration optimises space utilisation

Parallel board-to-board configuration optimises space utilisation

Stackable design allows for multiple levels of connections

Stackable design allows for multiple levels of connections

High surface mount capability supports advanced assembly techniques

High surface mount capability supports advanced assembly techniques

Natural housing colour complements various PCB aesthetics

Natural housing colour complements various PCB aesthetics

Polarisation feature improves mating accuracy

Polarisation feature improves mating accuracy

Low halogen materials support environmental compliance

Low halogen materials support environmental compliance

Reflow solder capability simplifies manufacturing processes

Reflow solder capability simplifies manufacturing processes