TE Connectivity 0.6mm Pitch 204 Way, Right Angle Board Mount Mount DDR3 DIMM Socket ,1.5 V ,500mA

The TE Connectivity Double data rate (DDR) 3 SO DIMM socket offers a sophisticated solution for memory card connectivity, tailored for modern electronic designs. Featuring a stack height of 5.2 mm and a right-angle module orientation, this connector is designed to fit seamlessly into compact spaces, ensuring efficient performance without compromising on accessibility. With 204 positions, it supports high-density memory modules, making it ideal for applications that demand reliable speed and efficacy. Crafted from high-temperature thermoplastic, its durable housing ensures longevity, while gold plating on contact areas enhances conductivity. This socket is engineered to meet rigorous electrical standards, ensuring it can withstand demanding operational environments.

The TE Connectivity Double data rate (DDR) 3 SO DIMM socket offers a sophisticated solution for memory card connectivity, tailored for modern electronic designs. Featuring a stack height of 5.2 mm and a right-angle module orientation, this connector is designed to fit seamlessly into compact spaces, ensuring efficient performance without compromising on accessibility. With 204 positions, it supports high-density memory modules, making it ideal for applications that demand reliable speed and efficacy. Crafted from high-temperature thermoplastic, its durable housing ensures longevity, while gold plating on contact areas enhances conductivity. This socket is engineered to meet rigorous electrical standards, ensuring it can withstand demanding operational environments.

Designed for high-density memory applicationsOptimised for space-constrained layoutsConstructed for exceptional durability and longevityGold plating enhances electrical conductivitySupports operational stability across a wide temperature rangeOffers reverse keying to prevent incorrect insertionSurface mount termination simplifies integration into PCB designsSuitable for high-performance computing requirements

Designed for high-density memory applicationsOptimised for space-constrained layoutsConstructed for exceptional durability and longevityGold plating enhances electrical conductivitySupports operational stability across a wide temperature rangeOffers reverse keying to prevent incorrect insertionSurface mount termination simplifies integration into PCB designsSuitable for high-performance computing requirements