TE Connectivity MICTOR Series Vertical Board PCB Header, 160 Contact(s), 0.8 mm Pitch

The TE Connectivity PCB mount header is designed for seamless board-to-board connectivity, ensuring efficient signal and power transmission in compact applications. Its vertical orientation saves valuable space while accommodating up to 160 positions, ideal for high-density PCB configurations. Engineered with premium materials, it features gold plating for enhanced conductivity and corrosion resistance. The product is adept at withstanding rigorous operating environments with a temperature range of -65 to 125 °C, making it suitable for various industrial applications. With a low profile and careful design, this header is also compliant with several important regulatory standards, ensuring dependable performance across a range of applications.

The TE Connectivity PCB mount header is designed for seamless board-to-board connectivity, ensuring efficient signal and power transmission in compact applications. Its vertical orientation saves valuable space while accommodating up to 160 positions, ideal for high-density PCB configurations. Engineered with premium materials, it features gold plating for enhanced conductivity and corrosion resistance. The product is adept at withstanding rigorous operating environments with a temperature range of -65 to 125 °C, making it suitable for various industrial applications. With a low profile and careful design, this header is also compliant with several important regulatory standards, ensuring dependable performance across a range of applications.

Offers high-density interconnections with 160 positionsConstructed from robust polyimide film for durabilityCompatible with surface mount technology for easy assemblyProvides excellent electrical performance with low impedanceIncorporates locating posts for precise PCB alignmentDesigned for reflow solder capability up to 260°CFeatures low halogen content for improved environmental complianceMaintains consistent performance under extreme temperature fluctuations

Offers high-density interconnections with 160 positions

Constructed from robust polyimide film for durability

Constructed from robust polyimide film for durability

Compatible with surface mount technology for easy assembly

Compatible with surface mount technology for easy assembly

Provides excellent electrical performance with low impedance

Provides excellent electrical performance with low impedance

Incorporates locating posts for precise PCB alignment

Incorporates locating posts for precise PCB alignment

Designed for reflow solder capability up to 260°C

Designed for reflow solder capability up to 260°C

Features low halogen content for improved environmental compliance

Features low halogen content for improved environmental compliance

Maintains consistent performance under extreme temperature fluctuations

Maintains consistent performance under extreme temperature fluctuations