TE Connectivity Dynamic 2000 Series Vertical Board PCB Header, 120 Contact(s), 0.8 mm Pitch, Shrouded

The TE Connectivity PCB Mount Receptacle is a high-performance connector designed for seamless board-to-board applications. This component features a vertical orientation and accommodates 120 positions, ensuring a compact yet efficient connection for power and signal transfer. Its fully shrouded design enhances reliability while the gold plating on the contacts provides optimal conductivity. Suitable for surface mount technology, this connector is engineered to withstand a wide temperature range, making it ideal for diverse operating environments. The intricate design permits easy alignment and mounting, which streamlines assembly processes and minimizes installation time. Whether for industrial or consumer electronics, this durable receptacle guarantees unmatched performance and longevity.

The TE Connectivity PCB Mount Receptacle is a high-performance connector designed for seamless board-to-board applications. This component features a vertical orientation and accommodates 120 positions, ensuring a compact yet efficient connection for power and signal transfer. Its fully shrouded design enhances reliability while the gold plating on the contacts provides optimal conductivity. Suitable for surface mount technology, this connector is engineered to withstand a wide temperature range, making it ideal for diverse operating environments. The intricate design permits easy alignment and mounting, which streamlines assembly processes and minimizes installation time. Whether for industrial or consumer electronics, this durable receptacle guarantees unmatched performance and longevity.

Utilises gold (Au) plating for superior electrical conductivityCapable of withstanding operating temperatures from -65 to 125 °COffers parallel board-to-board configuration for optimal spatial efficiencyDesigned to meet UL 94V-0 flammability standards for enhanced safetyLow halogen content makes it environmentally compliantFeatures a robust housing material for increased durabilityReflow solder capable, ensuring compatibility with modern manufacturing processes

Utilises gold (Au) plating for superior electrical conductivity

Capable of withstanding operating temperatures from -65 to 125 °C

Capable of withstanding operating temperatures from -65 to 125 °C

Offers parallel board-to-board configuration for optimal spatial efficiency

Offers parallel board-to-board configuration for optimal spatial efficiency

Designed to meet UL 94V-0 flammability standards for enhanced safety

Designed to meet UL 94V-0 flammability standards for enhanced safety

Low halogen content makes it environmentally compliant

Low halogen content makes it environmentally compliant

Features a robust housing material for increased durability

Features a robust housing material for increased durability

Reflow solder capable, ensuring compatibility with modern manufacturing processes

Reflow solder capable, ensuring compatibility with modern manufacturing processes