TE Connectivity Buchanan Series PCB Terminal Block, 20-Contact, 3.81mm Pitch, Board Mount, 1-Row, Solder, Through Hole

The TE Connectivity 20 Position PCB Terminal Block from te connectivity provides a robust solution for wire-to-board applications. Designed for ease of use, this header-style connector ensures reliable connections in various electronic systems. Its vertical orientation and high-temperature polyamide housing make it suitable for demanding environments, offering excellent durability. With a 3.81 mm centreline and a rating of 300 VAC, this terminal block is poised to handle power and signal requirements efficiently. It also features a low halogen content, aligning with compliance standards for environmentally friendly components. A smart choice for modern electrical designs, this connector simplifies installations while maintaining high standards of performance.

The TE Connectivity 20 Position PCB Terminal Block from te connectivity provides a robust solution for wire-to-board applications. Designed for ease of use, this header-style connector ensures reliable connections in various electronic systems. Its vertical orientation and high-temperature polyamide housing make it suitable for demanding environments, offering excellent durability. With a 3.81 mm centreline and a rating of 300 VAC, this terminal block is poised to handle power and signal requirements efficiently. It also features a low halogen content, aligning with compliance standards for environmentally friendly components. A smart choice for modern electrical designs, this connector simplifies installations while maintaining high standards of performance.

Fully shrouded header design enhances safety and connection integritySide stackable configuration allows for versatile design implementationsThrough hole solder termination method promotes secure mounting to PCBsCopper magnesium contact base provides excellent conductivityLow halogen content supports compliance with environmental regulationsReflow solder capability allows for automated assembly processes

Fully shrouded header design enhances safety and connection integritySide stackable configuration allows for versatile design implementationsThrough hole solder termination method promotes secure mounting to PCBsCopper magnesium contact base provides excellent conductivityLow halogen content supports compliance with environmental regulationsReflow solder capability allows for automated assembly processes