TE Connectivity, 2-331 Discrete Socket, 21 → 20 AWG Wire Size

The TE Connectivity Miniature spring socket connector is engineered to provide reliable performance in compact electronic applications. Designed with an open-bottom sleeve style, it accommodates discrete wire connections, making it ideal for board-to-cable configurations in a variety of settings. The use of high-quality materials such as beryllium copper for the contact base ensures optimal conductivity and longevity, while the gold plating enhances durability against wear and corrosion. This connector not only meets industry standards for power and signal applications but also boasts flexibility in insertion methods, supporting hand, semi-automatic, and automatic systems. With its user-friendly design, this socket simplifies installation and maintenance while ensuring a secure and robust connection.

The TE Connectivity Miniature spring socket connector is engineered to provide reliable performance in compact electronic applications. Designed with an open-bottom sleeve style, it accommodates discrete wire connections, making it ideal for board-to-cable configurations in a variety of settings. The use of high-quality materials such as beryllium copper for the contact base ensures optimal conductivity and longevity, while the gold plating enhances durability against wear and corrosion. This connector not only meets industry standards for power and signal applications but also boasts flexibility in insertion methods, supporting hand, semi-automatic, and automatic systems. With its user-friendly design, this socket simplifies installation and maintenance while ensuring a secure and robust connection.

Optimised for printed circuit board applicationsSuitable for 20 21 AWG wire sizesTin plated copper construction for improved durability30 μm gold plating provides superior conductivity and corrosion resistanceMeets EU RoHS and ELV directive compliance for safetyPackaged in bags with a quantity of 2000 for convenienceOperational in various solder processes without high temperature concerns

Optimised for printed circuit board applicationsSuitable for 20 21 AWG wire sizesTin plated copper construction for improved durability30 μm gold plating provides superior conductivity and corrosion resistanceMeets EU RoHS and ELV directive compliance for safetyPackaged in bags with a quantity of 2000 for convenienceOperational in various solder processes without high temperature concerns