TE Connectivity 2312 Series Horizontal Board Mount PCB Header, 42-Contact, 4-Row, Solder, Through Hole Termination

The TE Connectivity NANO-PITCH 42 CIRCUIT, X4 RECEPTACLE XD is engineered for high-performance connectivity in compact electronic applications. This advanced receptacle features a unique design that facilitates superior data transmission and ensures reliability in challenging environments. With a focus on sustainability, this product complies with essential regulatory directives, making it an ideal choice for environmentally conscious manufacturers. Its robust construction accommodates high-volume assembly processes, aligning with modern manufacturing demands while providing efficient solder process capability up to 260°C. The product stands out not only for its technical specifications but also for its applications in diverse sectors, from automotive to industrial electronics, enhancing versatility in usage.

The TE Connectivity NANO-PITCH 42 CIRCUIT, X4 RECEPTACLE XD is engineered for high-performance connectivity in compact electronic applications. This advanced receptacle features a unique design that facilitates superior data transmission and ensures reliability in challenging environments. With a focus on sustainability, this product complies with essential regulatory directives, making it an ideal choice for environmentally conscious manufacturers. Its robust construction accommodates high-volume assembly processes, aligning with modern manufacturing demands while providing efficient solder process capability up to 260°C. The product stands out not only for its technical specifications but also for its applications in diverse sectors, from automotive to industrial electronics, enhancing versatility in usage.

Compact design optimises space in various applicationsHigh performance materials ensure longevity and durabilityComplies with EU RoHS and ELV directives for heightened complianceReflow solder capable at high temperatures enhances manufacturing efficiencyVersatile deployment across multiple sectors facilitating diverse applicationsFuture proof with alignment to evolving regulatory standards

Compact design optimises space in various applicationsHigh performance materials ensure longevity and durabilityComplies with EU RoHS and ELV directives for heightened complianceReflow solder capable at high temperatures enhances manufacturing efficiencyVersatile deployment across multiple sectors facilitating diverse applicationsFuture proof with alignment to evolving regulatory standards