Molex 503552 Series Vertical Surface PCB Header, 18 Contact(s), 0.4 mm Pitch, 2 Row, Unshrouded

The TE Connectivity 0.40mm pitch board-to-board connectors represent a sophisticated solution for modern electronics, designed to enhance connectivity and performance in compact spaces. This connector excels in applications requiring precise alignment and high-density configurations, offering remarkable reliability and ease of use. The dual-row, vertical stacking design not only saves space but also allows for efficient signal integrity, making it an ideal choice for advanced applications in various industries. With a durable mating height of 0.70mm and a robust surface mount configuration, this connector series ensures long-lasting performance, supporting up to 30 mating cycles while maintaining optimal functionality across a broad temperature range. Its superior material composition, including copper alloy with gold plating, guarantees excellent conductivity and resistance to wear, further solidifying its place as a go-to solution for board-to-board connections.

The TE Connectivity 0.40mm pitch board-to-board connectors represent a sophisticated solution for modern electronics, designed to enhance connectivity and performance in compact spaces. This connector excels in applications requiring precise alignment and high-density configurations, offering remarkable reliability and ease of use. The dual-row, vertical stacking design not only saves space but also allows for efficient signal integrity, making it an ideal choice for advanced applications in various industries. With a durable mating height of 0.70mm and a robust surface mount configuration, this connector series ensures long-lasting performance, supporting up to 30 mating cycles while maintaining optimal functionality across a broad temperature range. Its superior material composition, including copper alloy with gold plating, guarantees excellent conductivity and resistance to wear, further solidifying its place as a go-to solution for board-to-board connections.

Designed for high-density configurations, ensuring optimal space utilisationProvides reliable connectivity for advanced electronic applicationsBoasts a durable mating height to withstand various operational demandsSupports an impressive number of mating cycles, enhancing longevityUtilises high-quality materials for improved electrical performanceFacilitates efficient signal integrity across a broad temperature rangeManufactured with environmental compliance, aligning with modern standards

Designed for high-density configurations, ensuring optimal space utilisation

Provides reliable connectivity for advanced electronic applications

Provides reliable connectivity for advanced electronic applications

Boasts a durable mating height to withstand various operational demands

Boasts a durable mating height to withstand various operational demands

Supports an impressive number of mating cycles, enhancing longevity

Supports an impressive number of mating cycles, enhancing longevity

Utilises high-quality materials for improved electrical performance

Utilises high-quality materials for improved electrical performance

Facilitates efficient signal integrity across a broad temperature range

Facilitates efficient signal integrity across a broad temperature range

Manufactured with environmental compliance, aligning with modern standards

Manufactured with environmental compliance, aligning with modern standards