TE Connectivity AMPMODU Series Vertical Board PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

The TE Connectivity PCB Mount Header offers an exceptional solution for efficient board-to-board connectivity with its versatile vertical orientation. Designed to accommodate 14 positions on a 2.54 mm (.1 in) centreline, this unshrouded connector ensures reliable connections, making it ideal for various applications. Its through-hole soldering method enhances stability and performance while ensuring seamless integration with printed circuit boards. The innovative design prioritises both functionality and durability, with gold-plated contacts providing improved conductivity and resistance to corrosion. Suitable for a wide operating temperature range, this header excels in demanding environments, ensuring the integrity of electrical connections across diverse applications. With its array of features tailored for optimal performance, this PCB Mount Header stands out in the AMPMODU Headers series, promising to meet the rigorous standards of modern electronic assembly.

The TE Connectivity PCB Mount Header offers an exceptional solution for efficient board-to-board connectivity with its versatile vertical orientation. Designed to accommodate 14 positions on a 2.54 mm (.1 in) centreline, this unshrouded connector ensures reliable connections, making it ideal for various applications. Its through-hole soldering method enhances stability and performance while ensuring seamless integration with printed circuit boards. The innovative design prioritises both functionality and durability, with gold-plated contacts providing improved conductivity and resistance to corrosion. Suitable for a wide operating temperature range, this header excels in demanding environments, ensuring the integrity of electrical connections across diverse applications. With its array of features tailored for optimal performance, this PCB Mount Header stands out in the AMPMODU Headers series, promising to meet the rigorous standards of modern electronic assembly.

Allows for easy and secure board-to-board connectionsDesigned for high-density applications with 14 positioning capabilitiesGold plating on contacts ensures enhanced conductivityMatte finish leads to reduced solder joint issues during assemblyBuilt from thermoplastic housing to resist damage in harsh conditionsCompatible with both wave and hand soldering processesStandard pitch design facilitates simple PCB layout integrationMeets industry standards for compliance, ensuring quality and reliability

Allows for easy and secure board-to-board connections

Designed for high-density applications with 14 positioning capabilities

Designed for high-density applications with 14 positioning capabilities

Gold plating on contacts ensures enhanced conductivity

Gold plating on contacts ensures enhanced conductivity

Matte finish leads to reduced solder joint issues during assembly

Matte finish leads to reduced solder joint issues during assembly

Built from thermoplastic housing to resist damage in harsh conditions

Built from thermoplastic housing to resist damage in harsh conditions

Compatible with both wave and hand soldering processes

Compatible with both wave and hand soldering processes

Standard pitch design facilitates simple PCB layout integration

Standard pitch design facilitates simple PCB layout integration

Meets industry standards for compliance, ensuring quality and reliability

Meets industry standards for compliance, ensuring quality and reliability