TE Connectivity, 5499913, 5499913-6 0.3mm Pitch 26 Way Right Angle FPC Connector, Bottom

The TE Connectivity Wire-to-board connector offers a robust solution for seamless connectivity in compact electronic applications. Designed with a 26-position configuration and a 2.54 mm centreline, it ensures reliable solder connections with its right-angle, through-hole design. Engineered from high-quality materials, this connector is ideal for challenging environments, boasting an impressive operating temperature range. The universal header design facilitates easy integration into various PCB layouts, enhancing overall application versatility. Whether for signal transmission or power delivery, this connector excels in performance, making it a preferred choice for engineers and designers seeking reliability and efficiency.

The TE Connectivity Wire-to-board connector offers a robust solution for seamless connectivity in compact electronic applications. Designed with a 26-position configuration and a 2.54 mm centreline, it ensures reliable solder connections with its right-angle, through-hole design. Engineered from high-quality materials, this connector is ideal for challenging environments, boasting an impressive operating temperature range. The universal header design facilitates easy integration into various PCB layouts, enhancing overall application versatility. Whether for signal transmission or power delivery, this connector excels in performance, making it a preferred choice for engineers and designers seeking reliability and efficiency.

Designed for through-hole soldering for improved reliabilityFeatures a standard connector profile to fit in diverse applicationsCompliant with industry standards, ensuring quality and safetyUtilises gold-plated contact areas for enhanced conductivitySolder process capability allows for high-temperature soldering

Designed for through-hole soldering for improved reliabilityFeatures a standard connector profile to fit in diverse applicationsCompliant with industry standards, ensuring quality and safetyUtilises gold-plated contact areas for enhanced conductivitySolder process capability allows for high-temperature soldering