TE Connectivity 2.54mm Pitch 16 Way Through Hole DIP IC Socket

The TE Connectivity Socket assembly is a highly efficient and reliable DIP socket designed for seamless integration with printed circuit boards. Engineered to accommodate 16 positions, this standard socket offers optimal performance in various electronic applications. Its robust open frame style facilitates easy insertion and removal of ICs, while the stamped and formed contact fabrication ensures a strong electrical connection. The combination of gold plating on the contact mating area enhances durability and conductance, making this socket ideal for demanding environments. With a vertical PCB mount orientation, this component is well-suited for space-constrained designs, ensuring that you can maximise functionality without compromising on device footprint.

The TE Connectivity Socket assembly is a highly efficient and reliable DIP socket designed for seamless integration with printed circuit boards. Engineered to accommodate 16 positions, this standard socket offers optimal performance in various electronic applications. Its robust open frame style facilitates easy insertion and removal of ICs, while the stamped and formed contact fabrication ensures a strong electrical connection. The combination of gold plating on the contact mating area enhances durability and conductance, making this socket ideal for demanding environments. With a vertical PCB mount orientation, this component is well-suited for space-constrained designs, ensuring that you can maximise functionality without compromising on device footprint.

Designed for standard, stamped and formed applicationsFeatures gold plating for superior conductivity and durabilityOffers easy integration with vertical PCB mount orientationOptimised for 16 positions to support multiple applicationsProvides reliable wave soldering capabilitiesFacilitates enhanced electrical performance in various environmentsStreamlined open frame design allows for quick IC changesSupports widespread usage across various electronic manufacturing sectors

Designed for standard, stamped and formed applicationsFeatures gold plating for superior conductivity and durabilityOffers easy integration with vertical PCB mount orientationOptimised for 16 positions to support multiple applicationsProvides reliable wave soldering capabilitiesFacilitates enhanced electrical performance in various environmentsStreamlined open frame design allows for quick IC changesSupports widespread usage across various electronic manufacturing sectors