Molex 503308 Series Vertical Surface PCB Header, 50 Contact(s), 0.4 mm Pitch, 2 Row, Unshrouded

The TE Connectivity 0.40mm pitch board-to-board connector is designed for applications demanding high-density interconnection. With its dual-row vertical stacking configuration and a compact mated height of just 0.70mm, this connector effectively maximises space on printed circuit boards while ensuring reliable signal integrity. Tailored for surface mount technology, it caters to evolving electronic designs that require versatility and performance. The product stands out not only for its robust copper alloy construction but also for its low-halogen resin, ensuring environmental compliance without compromising on durability. Ideal for signal applications, this connector is your go-to solution for seamless integration in compact electronic devices.

The TE Connectivity 0.40mm pitch board-to-board connector is designed for applications demanding high-density interconnection. With its dual-row vertical stacking configuration and a compact mated height of just 0.70mm, this connector effectively maximises space on printed circuit boards while ensuring reliable signal integrity. Tailored for surface mount technology, it caters to evolving electronic designs that require versatility and performance. The product stands out not only for its robust copper alloy construction but also for its low-halogen resin, ensuring environmental compliance without compromising on durability. Ideal for signal applications, this connector is your go-to solution for seamless integration in compact electronic devices.

Dual-row design optimises board space usageVertical stacking enhances flexibility in layoutSurface mount technology ensures easy assemblyCopper alloy construction provides superior conductivityLow-halogen material meets stringent environmental standardsDurability with a maximum of 30 mating cycles ensures longevityRated for a broad temperature range of -40°C to +85°CCompact form factor suits high-density applications

Dual-row design optimises board space usage

Vertical stacking enhances flexibility in layout

Vertical stacking enhances flexibility in layout

Surface mount technology ensures easy assembly

Surface mount technology ensures easy assembly

Copper alloy construction provides superior conductivity

Copper alloy construction provides superior conductivity

Low-halogen material meets stringent environmental standards

Low-halogen material meets stringent environmental standards

Durability with a maximum of 30 mating cycles ensures longevity

Durability with a maximum of 30 mating cycles ensures longevity

Rated for a broad temperature range of -40°C to +85°C

Rated for a broad temperature range of -40°C to +85°C

Compact form factor suits high-density applications

Compact form factor suits high-density applications