TE Connectivity AMPMODU Series Vertical Board PCB Header, 20 Contact(s), 1.27 mm Pitch, 1 Row, Shrouded

The TE Connectivity PCB Mount Header is a cutting-edge connector designed for optimal performance in board-to-board applications. Featuring a vertical orientation and a fully shrouded design, this component ensures secure and reliable connectivity with its 20 positions and 1.27mm centreline. The use of high-quality materials, including gold-plated contacts and a robust LCP housing, guarantees longevity and consistent electrical performance, catering to the demands of modern electronic devices. It is suitable for a variety of industries and applications where signal integrity and temperature stability are crucial. With its advanced features, this connector simplifies assembly while ensuring a reliable connection, making it a must-have for any engineer’s toolkit.

The TE Connectivity PCB Mount Header is a cutting-edge connector designed for optimal performance in board-to-board applications. Featuring a vertical orientation and a fully shrouded design, this component ensures secure and reliable connectivity with its 20 positions and 1.27mm centreline. The use of high-quality materials, including gold-plated contacts and a robust LCP housing, guarantees longevity and consistent electrical performance, catering to the demands of modern electronic devices. It is suitable for a variety of industries and applications where signal integrity and temperature stability are crucial. With its advanced features, this connector simplifies assembly while ensuring a reliable connection, making it a must-have for any engineer’s toolkit.

Designed for secure board to board connectivityFully shrouded for improved protection against dust and debrisCompact 1.27mm centreline helps save precious space on PCBDurable materials ensure long lasting performance even under high stress conditionsNickel underplating enhances durability and conductivityPolarization feature aids in correct mating alignment

Designed for secure board to board connectivity

Fully shrouded for improved protection against dust and debris

Fully shrouded for improved protection against dust and debris

Compact 1.27mm centreline helps save precious space on PCB

Compact 1.27mm centreline helps save precious space on PCB

Durable materials ensure long lasting performance even under high stress conditions

Durable materials ensure long lasting performance even under high stress conditions

Nickel underplating enhances durability and conductivity

Nickel underplating enhances durability and conductivity

Polarization feature aids in correct mating alignment

Polarization feature aids in correct mating alignment