TE Connectivity 1.02mm Pitch 30 Way SMT IC Socket

The TE Connectivity SOCKET ASSY LGA2011 is engineered to provide exceptional connectivity for high-performance applications. This advanced IC socket is specifically designed to accommodate devices with 2011 positions within a compact and robust structure. With its surface mount solder ball termination method, it ensures reliable operation in demanding environments. The socket's square frame design enhances stability while the high-temperature thermoplastic housing material guarantees durability. It is particularly ideal for configurations requiring a high pin count, making it an essential component in modern electronic systems. Additionally, compliance with industry standards such as UL 94V-0 reinforces its credibility and safety for diverse applications.

The TE Connectivity SOCKET ASSY LGA2011 is engineered to provide exceptional connectivity for high-performance applications. This advanced IC socket is specifically designed to accommodate devices with 2011 positions within a compact and robust structure. With its surface mount solder ball termination method, it ensures reliable operation in demanding environments. The socket's square frame design enhances stability while the high-temperature thermoplastic housing material guarantees durability. It is particularly ideal for configurations requiring a high pin count, making it an essential component in modern electronic systems. Additionally, compliance with industry standards such as UL 94V-0 reinforces its credibility and safety for diverse applications.

Optimised for high performance applications requiring 2011 positionsDurable construction using high temperature thermoplastic materialSquare frame design elevates stability and ease of integrationSurface mount technology enables compact PCB layoutsGold plated contact area ensures superior electrical conductivityLow halogen materials contribute to environmentally friendly manufacturingReflow solder capability supports efficient assembly processesCompliant with EU RoHS and REACH regulationsVersatile application in board to board configurations

Optimised for high performance applications requiring 2011 positionsDurable construction using high temperature thermoplastic materialSquare frame design elevates stability and ease of integrationSurface mount technology enables compact PCB layoutsGold plated contact area ensures superior electrical conductivityLow halogen materials contribute to environmentally friendly manufacturingReflow solder capability supports efficient assembly processesCompliant with EU RoHS and REACH regulationsVersatile application in board to board configurations