TE Connectivity AMPMODU Series Vertical Board PCB Header, 20 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

The TE Connectivity PCB mount header is specifically designed for vertical board-to-board applications, offering a robust solution with 20 positions on a 2.54 mm centerline. Featuring a fully shrouded design, the connector ensures secure and reliable connectivity while protecting against potential misalignment during mating. The premium materials used include gold-plated contacts for enhanced conductivity and a thermoplastic housing that withstands harsh environmental conditions. This connector assembly is ideal for applications requiring a reliable connection in compact spaces, making it the optimal choice for manufacturers aiming to maintain quality and performance in their electronic designs.

The TE Connectivity PCB mount header is specifically designed for vertical board-to-board applications, offering a robust solution with 20 positions on a 2.54 mm centerline. Featuring a fully shrouded design, the connector ensures secure and reliable connectivity while protecting against potential misalignment during mating. The premium materials used include gold-plated contacts for enhanced conductivity and a thermoplastic housing that withstands harsh environmental conditions. This connector assembly is ideal for applications requiring a reliable connection in compact spaces, making it the optimal choice for manufacturers aiming to maintain quality and performance in their electronic designs.

Fully shrouded design aids in preventing misalignmentNickel underplating enhances the durability of the contactsPolarization feature simplifies the mating processWave solder capability ensures compatibility with automated assemblySuitable for a broad operating temperature rangeCompact dimensions allow for efficient use of spaceStandard row-to-row spacing facilitates integration into existing designsMeets various industry standards for compliance assurance

Fully shrouded design aids in preventing misalignment

Nickel underplating enhances the durability of the contacts

Nickel underplating enhances the durability of the contacts

Polarization feature simplifies the mating process

Polarization feature simplifies the mating process

Wave solder capability ensures compatibility with automated assembly

Wave solder capability ensures compatibility with automated assembly

Suitable for a broad operating temperature range

Suitable for a broad operating temperature range

Compact dimensions allow for efficient use of space

Compact dimensions allow for efficient use of space

Standard row-to-row spacing facilitates integration into existing designs

Standard row-to-row spacing facilitates integration into existing designs

Meets various industry standards for compliance assurance

Meets various industry standards for compliance assurance