TE Connectivity AMP HPI Series Vertical Board PCB Header, 13 Contact(s), 1 mm Pitch, 1 Row, Shrouded

The TE Connectivity HPI 1.0 mm Headers series is designed to deliver reliable and efficient connections within electronic devices. Featuring a vertical PCB mount header configuration, this product excels in versatility, making it suitable for various applications where space is at a premium. Constructed from high-temperature thermoplastic and embellished with an ivory finish, this header not only ensures durability but also contributes to aesthetic appeal in modern circuit board designs. Its unique fully loaded contact load condition and ability to withstand operational voltages of up to 50 VDC commend it as a robust solution for wire-to-board connections. The thoughtful design includes features for mating alignment and retention, ensuring that the connections remain secure under typical operational conditions. Altogether, this series embodies quality, reliability, and innovation, setting a benchmark for PCB connectors.

The TE Connectivity HPI 1.0 mm Headers series is designed to deliver reliable and efficient connections within electronic devices. Featuring a vertical PCB mount header configuration, this product excels in versatility, making it suitable for various applications where space is at a premium. Constructed from high-temperature thermoplastic and embellished with an ivory finish, this header not only ensures durability but also contributes to aesthetic appeal in modern circuit board designs. Its unique fully loaded contact load condition and ability to withstand operational voltages of up to 50 VDC commend it as a robust solution for wire-to-board connections. The thoughtful design includes features for mating alignment and retention, ensuring that the connections remain secure under typical operational conditions. Altogether, this series embodies quality, reliability, and innovation, setting a benchmark for PCB connectors.

Designed for wire to board applications enhancing connection stabilityCompact dimensions facilitate integration into densely populated circuit boardsHousing material optimised for high temperature environments for increased longevityMating alignment features improve ease of installation reducing assembly timePolarization options help prevent incorrect mating during installationMatte finish on plating areas enhances conductivity and reduces wear

Designed for wire to board applications enhancing connection stability

Compact dimensions facilitate integration into densely populated circuit boards

Compact dimensions facilitate integration into densely populated circuit boards

Housing material optimised for high temperature environments for increased longevity

Housing material optimised for high temperature environments for increased longevity

Mating alignment features improve ease of installation reducing assembly time

Mating alignment features improve ease of installation reducing assembly time

Polarization options help prevent incorrect mating during installation

Polarization options help prevent incorrect mating during installation

Matte finish on plating areas enhances conductivity and reduces wear

Matte finish on plating areas enhances conductivity and reduces wear