TE Connectivity AMPMODU Series Vertical Board PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

The TE Connectivity PCB Mount Header offers a robust solution for board-to-board connectivity, ideal for demanding electronic applications. Designed with a vertical orientation and a breakaway header type, it efficiently accommodates 14 positions on a 2.54 mm centreline, ensuring a secure fit in your electronic assemblies. The header's through-hole solder design makes installation straightforward, while its durable construction is complemented by a sleek black thermoplastic housing. Designed to operate in high-stress environments, this connector supports operating temperatures from -65 to 105 °C, ensuring reliability under diverse conditions. With compatibility to various industry standards, this product exemplifies both performance and versatility for your connectivity needs, making it a trusted choice for engineers seeking reliable solutions in their projects.

The TE Connectivity PCB Mount Header offers a robust solution for board-to-board connectivity, ideal for demanding electronic applications. Designed with a vertical orientation and a breakaway header type, it efficiently accommodates 14 positions on a 2.54 mm centreline, ensuring a secure fit in your electronic assemblies. The header's through-hole solder design makes installation straightforward, while its durable construction is complemented by a sleek black thermoplastic housing. Designed to operate in high-stress environments, this connector supports operating temperatures from -65 to 105 °C, ensuring reliability under diverse conditions. With compatibility to various industry standards, this product exemplifies both performance and versatility for your connectivity needs, making it a trusted choice for engineers seeking reliable solutions in their projects.

Designed for easy integration into PCB assembliesFeatures a breakaway design for flexible configurationSuitable for fully loaded connector contact load conditionsUtilises nickel and tin underplating for enhanced conductivityOptimised for through-hole solder termination for strong attachmentConstructed from high-quality thermoplastic for durabilityConfigured for parallel board-to-board connections

Designed for easy integration into PCB assemblies

Features a breakaway design for flexible configuration

Features a breakaway design for flexible configuration

Suitable for fully loaded connector contact load conditions

Suitable for fully loaded connector contact load conditions

Utilises nickel and tin underplating for enhanced conductivity

Utilises nickel and tin underplating for enhanced conductivity

Optimised for through-hole solder termination for strong attachment

Optimised for through-hole solder termination for strong attachment

Constructed from high-quality thermoplastic for durability

Constructed from high-quality thermoplastic for durability

Configured for parallel board-to-board connections

Configured for parallel board-to-board connections