TE Connectivity Z-PACK Series Vertical Board PCB Header, 60 Contact(s), 2.5 mm Pitch, 6 Row, Shrouded

The TE Connectivity 60 Position High Speed Backplane Connector, part of the Z-PACK HS3 series, redefines connectivity solutions. Designed for printed circuit board (PCB) applications, this vertical, partially shrouded header enables efficient signal transmission and robust performance. With 60 positions spread across 6 rows and 5 columns, it accommodates high-density interconnections, simplifying the design while maximising efficiency. Its 2.5 mm centreline facilitates ease of integration into compact spaces, ensuring it meets modern electronic demands. This connector is not just about utility; it’s constructed from materials that provide durability and reliability, making it suitable for varied environments, from standard to extreme temperatures. Enhance your PCB projects with a truly versatile connector that exhibits both form and function.

The TE Connectivity 60 Position High Speed Backplane Connector, part of the Z-PACK HS3 series, redefines connectivity solutions. Designed for printed circuit board (PCB) applications, this vertical, partially shrouded header enables efficient signal transmission and robust performance. With 60 positions spread across 6 rows and 5 columns, it accommodates high-density interconnections, simplifying the design while maximising efficiency. Its 2.5 mm centreline facilitates ease of integration into compact spaces, ensuring it meets modern electronic demands. This connector is not just about utility; it’s constructed from materials that provide durability and reliability, making it suitable for varied environments, from standard to extreme temperatures. Enhance your PCB projects with a truly versatile connector that exhibits both form and function.

Designed to terminate directly to printed circuit boardsAllows for easy integration in traditional backplane architecturesFeatures a robust dual beam contact shape for reliable connectionsEmploys a press-fit termination method for secure assemblyIncorporates ESD/HDI guide pin style aiding in precise alignmentConstructed with low halogen materials for enhanced environmental complianceThe compact design aids in reducing PCB real estate whilst ensuring high performanceFlexible operating temperature range making it suitable for diverse applications

Designed to terminate directly to printed circuit boards

Allows for easy integration in traditional backplane architectures

Allows for easy integration in traditional backplane architectures

Features a robust dual beam contact shape for reliable connections

Features a robust dual beam contact shape for reliable connections

Employs a press-fit termination method for secure assembly

Employs a press-fit termination method for secure assembly

Incorporates ESD/HDI guide pin style aiding in precise alignment

Incorporates ESD/HDI guide pin style aiding in precise alignment

Constructed with low halogen materials for enhanced environmental compliance

Constructed with low halogen materials for enhanced environmental compliance

The compact design aids in reducing PCB real estate whilst ensuring high performance

The compact design aids in reducing PCB real estate whilst ensuring high performance

Flexible operating temperature range making it suitable for diverse applications

Flexible operating temperature range making it suitable for diverse applications