TE Connectivity 5-103 Series Vertical Through Hole PCB Header, 10 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

The TE Connectivity PCB Mount Header is expertly designed for robust signal transmission, establishing a reliable board-to-board connection with its vertical orientation. Built with a fully shrouded rectangular shape, this component offers exceptional durability and protection for critical applications. With a 2.54 mm centreline, it ensures effortless integration into your circuit design. The high-quality gold plating enhances conductivity while the nickel underplating serves to prevent corrosion, ensuring long-lasting performance. Designed for a maximum operating temperature of 105 °C, this header can withstand the rigours of demanding environments. Its parallel configuration allows for fully loaded connector contact, making it a strong contender for modern electronic applications.

The TE Connectivity PCB Mount Header is expertly designed for robust signal transmission, establishing a reliable board-to-board connection with its vertical orientation. Built with a fully shrouded rectangular shape, this component offers exceptional durability and protection for critical applications. With a 2.54 mm centreline, it ensures effortless integration into your circuit design. The high-quality gold plating enhances conductivity while the nickel underplating serves to prevent corrosion, ensuring long-lasting performance. Designed for a maximum operating temperature of 105 °C, this header can withstand the rigours of demanding environments. Its parallel configuration allows for fully loaded connector contact, making it a strong contender for modern electronic applications.

Utilises high-grade thermoplastic housing for added durabilityOffers a parallel board-to-board configuration for enhanced connectivityIncorporates a detent window for secure mating retentionAllows through-hole solder termination for reliable circuit board attachmentDesigned with a compact footprint for space-efficient deploymentsFeatures a standard connector profile, simplifying mounting proceduresOptimised for high insulation resistance, promoting signal integrityProvides compatibility with various industry standards for flexibility in applicationCapable of wave soldering processes, extending its usability in manufacturing

Utilises high-grade thermoplastic housing for added durability

Offers a parallel board-to-board configuration for enhanced connectivity

Offers a parallel board-to-board configuration for enhanced connectivity

Incorporates a detent window for secure mating retention

Incorporates a detent window for secure mating retention

Allows through-hole solder termination for reliable circuit board attachment

Allows through-hole solder termination for reliable circuit board attachment

Designed with a compact footprint for space-efficient deployments

Designed with a compact footprint for space-efficient deployments

Features a standard connector profile, simplifying mounting procedures

Features a standard connector profile, simplifying mounting procedures

Optimised for high insulation resistance, promoting signal integrity

Optimised for high insulation resistance, promoting signal integrity

Provides compatibility with various industry standards for flexibility in application

Provides compatibility with various industry standards for flexibility in application

Capable of wave soldering processes, extending its usability in manufacturing

Capable of wave soldering processes, extending its usability in manufacturing