TE Connectivity 0.8mm Pitch 144 Way, Right Angle Board Mount Mount Small Outline DIMM Socket ,3.3 V

The TE Connectivity Socket is designed with versatility and performance at its core, suitable for various applications requiring precise memory connectivity. Featuring a 5.6 mm stack height, this right-angle module orientation ensures easy integration into compact designs without sacrificing space or functionality. The 144-position layout allows for robust connectivity, catering to a wide range of user needs while maintaining a high signal integrity even in demanding environments. Engineered from high-temperature plastic, this product promises durability, making it ideal for diverse operational conditions. Furthermore, compliance with industry standards like UL 94V-0 affirms its reliability in critical applications, granting peace of mind to manufacturers and design engineers alike. With this component, enhance your memory architecture while ensuring efficient performance and longevity.

The TE Connectivity Socket is designed with versatility and performance at its core, suitable for various applications requiring precise memory connectivity. Featuring a 5.6 mm stack height, this right-angle module orientation ensures easy integration into compact designs without sacrificing space or functionality. The 144-position layout allows for robust connectivity, catering to a wide range of user needs while maintaining a high signal integrity even in demanding environments. Engineered from high-temperature plastic, this product promises durability, making it ideal for diverse operational conditions. Furthermore, compliance with industry standards like UL 94V-0 affirms its reliability in critical applications, granting peace of mind to manufacturers and design engineers alike. With this component, enhance your memory architecture while ensuring efficient performance and longevity.

Robust 144-position configuration facilitates extensive connectivity optionsHigh-temperature plastic housing guarantees resilience in challenging environmentsRight-angle module orientation allows for space-efficient designsOptimised for 3.3V SGRAM applications ensuring compatibility with modern memory technologiesGold-plated contact areas enhance conductivity and reduce signal lossSurface mount termination method simplifies assembly processesLow halogen content ensures compliance with environmental standardsCam-in insertion style enhances reliability during the mating cycle

Robust 144-position configuration facilitates extensive connectivity optionsHigh-temperature plastic housing guarantees resilience in challenging environmentsRight-angle module orientation allows for space-efficient designsOptimised for 3.3V SGRAM applications ensuring compatibility with modern memory technologiesGold-plated contact areas enhance conductivity and reduce signal lossSurface mount termination method simplifies assembly processesLow halogen content ensures compliance with environmental standardsCam-in insertion style enhances reliability during the mating cycle