TE Connectivity 3-5177 Series Vertical Board PCB Header, 60 Contact(s), 0.8 mm Pitch, Shrouded

The TE Connectivity PCB Mount Header represents a high-quality solution for board-to-board connectivity, designed to meet the needs of contemporary electronic applications. With its vertical orientation and 60 positions, it ensures reliable performance while maintaining an efficient footprint. The fully shrouded design is crafted for secure connections, and its gold plating enhances conductivity while offering superior resistance to corrosion. Engineered for surface mount applications, this component stands out for its robustness and versatility, making it ideal for a diverse range of industries. Operating efficiently from -40 to 125 °C, it is equipped to handle demanding environments, ensuring longevity and reliability in your assemblies. Perfect for high-density applications, this header delivers exceptional signal integrity and simplifies assembly processes with its pick-and-place feature.

The TE Connectivity PCB Mount Header represents a high-quality solution for board-to-board connectivity, designed to meet the needs of contemporary electronic applications. With its vertical orientation and 60 positions, it ensures reliable performance while maintaining an efficient footprint. The fully shrouded design is crafted for secure connections, and its gold plating enhances conductivity while offering superior resistance to corrosion. Engineered for surface mount applications, this component stands out for its robustness and versatility, making it ideal for a diverse range of industries. Operating efficiently from -40 to 125 °C, it is equipped to handle demanding environments, ensuring longevity and reliability in your assemblies. Perfect for high-density applications, this header delivers exceptional signal integrity and simplifies assembly processes with its pick-and-place feature.

Durable design ensures longevity in various applicationsVertical mount orientation optimises space on the PCBOffers a gold plating finish for enhanced conductivityBuilt to withstand temperatures ranging from -40 to 125 °CDesigned for seamless integration into high-density electronic environmentsFeatures fully shrouded headers for secure and reliable connectionsSupports efficient surface mount assembly processesAccommodates industry-standard configurations with ease

Durable design ensures longevity in various applications

Vertical mount orientation optimises space on the PCB

Vertical mount orientation optimises space on the PCB

Offers a gold plating finish for enhanced conductivity

Offers a gold plating finish for enhanced conductivity

Built to withstand temperatures ranging from -40 to 125 °C

Built to withstand temperatures ranging from -40 to 125 °C

Designed for seamless integration into high-density electronic environments

Designed for seamless integration into high-density electronic environments

Features fully shrouded headers for secure and reliable connections

Features fully shrouded headers for secure and reliable connections

Supports efficient surface mount assembly processes

Supports efficient surface mount assembly processes

Accommodates industry-standard configurations with ease

Accommodates industry-standard configurations with ease