TE Connectivity AMPMODU Series Vertical Board PCB Header, 4 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

The TE Connectivity PCB mount header is designed for vertical board-to-board connections, featuring a robust 4-position layout on a 2.54 mm centreline. Engineered to deliver high reliability, it incorporates a breakaway functionality ideal for streamlined assembly processes. With a surface mount design, this component supports signal applications, making it a preferred choice in various electronic assemblies. The header is crafted from high-quality materials that ensure optimal performance and durability, even in demanding environments. Designed to meet industry standards, it ensures compatibility and compliance while offering a straightforward solution for your PCB connectivity needs.

The TE Connectivity PCB mount header is designed for vertical board-to-board connections, featuring a robust 4-position layout on a 2.54 mm centreline. Engineered to deliver high reliability, it incorporates a breakaway functionality ideal for streamlined assembly processes. With a surface mount design, this component supports signal applications, making it a preferred choice in various electronic assemblies. The header is crafted from high-quality materials that ensure optimal performance and durability, even in demanding environments. Designed to meet industry standards, it ensures compatibility and compliance while offering a straightforward solution for your PCB connectivity needs.

Vertical orientation optimises space on your PCBBreakaway design simplifies the assembly processNickel underplating enhances contact durabilitySurface mount technology offers ease of handling during productionLow-temperature solder capability allows compatibility with a variety of soldering applicationsSignal application focus ensures reliable communication between circuit boardsBlack colour ensures clear visibility of solder jointsParallel board-to-board configuration accommodates diverse layout requirements

Vertical orientation optimises space on your PCB

Breakaway design simplifies the assembly process

Breakaway design simplifies the assembly process

Nickel underplating enhances contact durability

Nickel underplating enhances contact durability

Surface mount technology offers ease of handling during production

Surface mount technology offers ease of handling during production

Low-temperature solder capability allows compatibility with a variety of soldering applications

Low-temperature solder capability allows compatibility with a variety of soldering applications

Signal application focus ensures reliable communication between circuit boards

Signal application focus ensures reliable communication between circuit boards

Black colour ensures clear visibility of solder joints

Black colour ensures clear visibility of solder joints

Parallel board-to-board configuration accommodates diverse layout requirements

Parallel board-to-board configuration accommodates diverse layout requirements