Phoenix Contact DMC Series Straight Wave Soldering Mount PCB Header, 14 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

The Phoenix Contact PCB header is designed to meet the rigorous demands of modern electronic applications, offering an efficient connection solution with a compact footprint. The DMC 1.5/7-G1-3.5 P26THR features a robust design that ensures reliability in various environments, including automated soldering processes. With its innovative multi-level conductor connections, this component allows for a higher density of contacts, making it ideal for space-constrained applications. Engineered from high-quality materials, the header provides exemplary performance across a range of electrical specifications, ensuring durability and dependable operations. Integrated into cutting-edge devices, this product stands out for its effective thermal and electrical properties, allowing for exceptional functionality and longevity.

The Phoenix Contact PCB header is designed to meet the rigorous demands of modern electronic applications, offering an efficient connection solution with a compact footprint. The DMC 1.5/7-G1-3.5 P26THR features a robust design that ensures reliability in various environments, including automated soldering processes. With its innovative multi-level conductor connections, this component allows for a higher density of contacts, making it ideal for space-constrained applications. Engineered from high-quality materials, the header provides exemplary performance across a range of electrical specifications, ensuring durability and dependable operations. Integrated into cutting-edge devices, this product stands out for its effective thermal and electrical properties, allowing for exceptional functionality and longevity.

Engineered for compatibility with surface mount technologyFacilitates better contact density due to its multi-level connection featureCompact design optimises space usage in electronic systemsManufactured with compliance to WEEE/RoHS regulations for environmental safetyOffers reliable sealing and insulation for enhanced performanceDesigned to withstand multiple solder cycles with minimal degradationFeatures a standard pin layout for easy integration into existing applicationsIncludes high-temperature materials suited for demanding environmentsDurable construction achieves high resistance against environmental stressPackaging in cardboard ensures safe delivery and protection during transit

Engineered for compatibility with surface mount technology

Facilitates better contact density due to its multi-level connection feature

Facilitates better contact density due to its multi-level connection feature

Compact design optimises space usage in electronic systems

Compact design optimises space usage in electronic systems

Manufactured with compliance to WEEE/RoHS regulations for environmental safety

Manufactured with compliance to WEEE/RoHS regulations for environmental safety

Offers reliable sealing and insulation for enhanced performance

Offers reliable sealing and insulation for enhanced performance

Designed to withstand multiple solder cycles with minimal degradation

Designed to withstand multiple solder cycles with minimal degradation

Features a standard pin layout for easy integration into existing applications

Features a standard pin layout for easy integration into existing applications

Includes high-temperature materials suited for demanding environments

Includes high-temperature materials suited for demanding environments

Durable construction achieves high resistance against environmental stress

Durable construction achieves high resistance against environmental stress

Packaging in cardboard ensures safe delivery and protection during transit

Packaging in cardboard ensures safe delivery and protection during transit