Phoenix Contact MCDNV Series Straight Through Hole PCB Header, 6 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

The Phoenix Contact MCDNV 1.5/3-G1-3.5 RNP14THR PCB header is expertly designed for seamless integration into contemporary SMT soldering processes. Its innovative pin layout allows for a compact multi-row arrangement, ensuring efficient use of board space. This component is tailored for through-hole reflow technology and exhibits exceptional reliability across various electrical requirements. With a combination of robust construction and intuitive locking mechanisms, it is ideal for applications requiring enhanced durability and stability. The header offers a versatile solution with multiple connection potentials, catering to diverse project needs while maintaining stringent compliance with industry standards.

The Phoenix Contact MCDNV 1.5/3-G1-3.5 RNP14THR PCB header is expertly designed for seamless integration into contemporary SMT soldering processes. Its innovative pin layout allows for a compact multi-row arrangement, ensuring efficient use of board space. This component is tailored for through-hole reflow technology and exhibits exceptional reliability across various electrical requirements. With a combination of robust construction and intuitive locking mechanisms, it is ideal for applications requiring enhanced durability and stability. The header offers a versatile solution with multiple connection potentials, catering to diverse project needs while maintaining stringent compliance with industry standards.

Designed for compatibility with through-hole reflow solderingSnap-in locking mechanism ensures secure connectionsVertical arrangement optimises PCB spaceConstructed with durable and reliable materialsUser-friendly design facilitates easy integration into existing systemsMaintains consistent performance across a wide range of temperaturesMeets rigorous electrical and mechanical testing standardsCompliant with WEEE and RoHS directives for environmental responsibilityPackaging designed for protection during transport and storage

Designed for compatibility with through-hole reflow soldering

Snap-in locking mechanism ensures secure connections

Snap-in locking mechanism ensures secure connections

Vertical arrangement optimises PCB space

Vertical arrangement optimises PCB space

Constructed with durable and reliable materials

Constructed with durable and reliable materials

User-friendly design facilitates easy integration into existing systems

User-friendly design facilitates easy integration into existing systems

Maintains consistent performance across a wide range of temperatures

Maintains consistent performance across a wide range of temperatures

Meets rigorous electrical and mechanical testing standards

Meets rigorous electrical and mechanical testing standards

Compliant with WEEE and RoHS directives for environmental responsibility

Compliant with WEEE and RoHS directives for environmental responsibility

Packaging designed for protection during transport and storage

Packaging designed for protection during transport and storage