Phoenix Contact MCDNV Series Vertical Wave Soldering Mount PCB Header, 6 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

The Phoenix Contact PCB header from the MCDNV 1.5/-G1-THR series is designed for optimal integration into modern electronic assemblies. With a pitch of 3.5 mm and a robust construction, it supports a nominal current of 8 A, ensuring reliable performance across various applications. The vertical connection design facilitates multi-row arrangements on PCBs, maximising space efficiency while maintaining a high degree of freedom for device design. Featuring a black housing, this component is constructed from durable materials, making it suitable for both THR soldering and wave soldering processes. Ideal for connectors utilising diverse connection technologies, it allows for increased contact density through its conductor connection on multiple levels. This product perfectly blends versatility and reliability, making it an excellent choice for engineers and manufacturers alike.

The Phoenix Contact PCB header from the MCDNV 1.5/-G1-THR series is designed for optimal integration into modern electronic assemblies. With a pitch of 3.5 mm and a robust construction, it supports a nominal current of 8 A, ensuring reliable performance across various applications. The vertical connection design facilitates multi-row arrangements on PCBs, maximising space efficiency while maintaining a high degree of freedom for device design. Featuring a black housing, this component is constructed from durable materials, making it suitable for both THR soldering and wave soldering processes. Ideal for connectors utilising diverse connection technologies, it allows for increased contact density through its conductor connection on multiple levels. This product perfectly blends versatility and reliability, making it an excellent choice for engineers and manufacturers alike.

Designed for seamless integration into SMT soldering processesFacilitates multi-row arrangements to optimise PCB layoutCompatible with various connection technologies for versatile applicationsEnables higher contact density with conductors operating across several levelsConstructed from reliable materials that comply with RoHS standardsIdeal for both reflow and wave soldering applicationsFeatures a pin layout that supports linear pinning for enhanced stabilityPacked in cardboard for eco-friendly and secure deliveryAccompanied by comprehensive user information and design guidelines

Designed for seamless integration into SMT soldering processes

Facilitates multi-row arrangements to optimise PCB layout

Facilitates multi-row arrangements to optimise PCB layout

Compatible with various connection technologies for versatile applications

Compatible with various connection technologies for versatile applications

Enables higher contact density with conductors operating across several levels

Enables higher contact density with conductors operating across several levels

Constructed from reliable materials that comply with RoHS standards

Constructed from reliable materials that comply with RoHS standards

Ideal for both reflow and wave soldering applications

Ideal for both reflow and wave soldering applications

Features a pin layout that supports linear pinning for enhanced stability

Features a pin layout that supports linear pinning for enhanced stability

Packed in cardboard for eco-friendly and secure delivery

Packed in cardboard for eco-friendly and secure delivery

Accompanied by comprehensive user information and design guidelines

Accompanied by comprehensive user information and design guidelines