Phoenix Contact MCV Series Vertical Solder PCB Header, 13 Contact(s), 3.81 mm Pitch, 1 Row, Unshrouded

The Phoenix Contact PCB header is designed for seamless integration into your electronic assemblies, offering unparalleled connectivity and flexibility. Ideal for applications requiring reliable performance, it features a compact design that facilitates multi-row arrangements on your PCB, making it versatile for various device configurations. The device incorporates advanced materials ensuring durability and compliance with both European and global safety standards. With a structure that supports a pin layout of linear pinning, it simplifies PCB design while enhancing user convenience. Additionally, this product has been engineered to withstand reflow soldering processes, integrating efficiency into manufacturing flows.

The Phoenix Contact PCB header is designed for seamless integration into your electronic assemblies, offering unparalleled connectivity and flexibility. Ideal for applications requiring reliable performance, it features a compact design that facilitates multi-row arrangements on your PCB, making it versatile for various device configurations. The device incorporates advanced materials ensuring durability and compliance with both European and global safety standards. With a structure that supports a pin layout of linear pinning, it simplifies PCB design while enhancing user convenience. Additionally, this product has been engineered to withstand reflow soldering processes, integrating efficiency into manufacturing flows.

Designed for multiple connection technologies, optimising device designSupports high power applications with robust current handlingManufactured to meet demanding temperature ratings, ensuring operational stabilityIdeal for reflow or wave soldering, enhancing ease of assemblyConstructed from high-quality materials that meet WEEE/RoHS standardsIntegration-ready for SMT soldering processes, streamlining production cyclesOffers consistent performance under varying environmental conditions

Designed for multiple connection technologies, optimising device design

Supports high power applications with robust current handling

Supports high power applications with robust current handling

Manufactured to meet demanding temperature ratings, ensuring operational stability

Manufactured to meet demanding temperature ratings, ensuring operational stability

Ideal for reflow or wave soldering, enhancing ease of assembly

Ideal for reflow or wave soldering, enhancing ease of assembly

Constructed from high-quality materials that meet WEEE/RoHS standards

Constructed from high-quality materials that meet WEEE/RoHS standards

Integration-ready for SMT soldering processes, streamlining production cycles

Integration-ready for SMT soldering processes, streamlining production cycles

Offers consistent performance under varying environmental conditions

Offers consistent performance under varying environmental conditions